Nordson YESTECH to show advanced 3D Technology for AOI at APEX 2016
Nordson YESTECH has announced that it will launch its latest innovation in 3D inspection at the IPC APEX EXPO. The new FX-940 ULTRA 3D AOI incorporates cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGA’s and other height sensitive devices.
With its Advanced Fusion Lighting and comprehensive inspection tools including angled cameras, full-color digital image processing and both image and rule-based algorithms, the FX-940 ULTRA offers complete inspection coverage with unsurpassed 2D and 3D defect detection. The FX-940 ULTRA provides high-powered inspection with:
- 12 MP / 5 axis 3D NYTVISION Technology
- Complete 2D + 3D inspection capabilities
- 1 top-down and 4 side viewing cameras
- Automatic programming tools: < 30 minutes
- High defect coverage / low false failures
- SPC data collection & reporting
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