Test & Measurement

Nordson YESTECH to show advanced 3D Technology for AOI at APEX 2016

17th February 2016
Peter Smith
0

Nordson YESTECH has announced  that it will launch its latest innovation in 3D inspection at the IPC APEX EXPO. The new FX-940 ULTRA 3D AOI incorporates cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGA’s and other height sensitive devices. 

With its Advanced Fusion Lighting and comprehensive inspection tools  including angled cameras, full-color digital image processing and both image and rule-based algorithms, the FX-940 ULTRA offers complete inspection coverage with unsurpassed 2D and 3D defect detection. The FX-940 ULTRA provides high-powered inspection with:

  • 12 MP / 5 axis 3D NYTVISION Technology
  • Complete 2D + 3D inspection capabilities
  • 1 top-down and 4 side viewing cameras
  • Automatic programming tools: < 30 minutes
  • High defect coverage / low false failures
  • SPC data collection & reporting

 

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