Nordson YESTECH just announced that AZP Inc. has purchased two BX Benchtop AOI systems. Based in Mesa, AZ, AZP Inc. is a private electronic contract manufacturer. Company owner Debbie Nguyen and the team at AZP are said to have conducted extensive evaluations on the BX Benchtop AOI and competitive systems before making their choice of the Nordson YESTECH system.

Nordson YESTECH will exhibit at SMTA International and will demonstrate the FX-940 ULTRA 3D AOI with 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices. 

STI Electronics, has acquired a Nordson YESTECH FX-940 ULTRA 3D Automated Optical Inspection (AOI) system. It provides STI’s contract assembly services with a significant improvement in throughput with the ability to inspect 1.5 million components per hour. The system’s accuracy rate will give customers a level of confidence far exceeding that of visual inspection or other AOI systems using older technology.

Nordson YESTECH has announced  that it will launch its latest innovation in 3D inspection at the IPC APEX EXPO. The new FX-940 ULTRA 3D AOI incorporates cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGA’s and other height sensitive devices. 

  At SMT/Hybrid/Packaging 2015, which takes place from 5th to 7th May at the Messe in Nuremberg, Germany, Nordson YESTECH will showcase its FX-940 AOI in-line PCB inspection system for the first time in Europe. The company will be situated at booth 7A-131.