New AOI equipment helps throughput and quality to rise together

The YTV B3 AOI machines, from YESTech yield enhancement solutions, provide automated inspection covering solder and lead defects, component presence and position, through-hole parts, and correct part and polarity identification.



Featuring a high magnification camera that delivers 12 micron pixel size and 1280 x 1024 image resolution, the YTV B3 gives exceptional defect coverage. A proprietary Fusion Lighting multi-angle LED system and advanced image processing technology integrates several techniques, including colour, normalized correlation and rule-base algorithms, to deliver complete inspection coverage with an extremely low false failure rate. It can support components down to size 0201.



Tom Dyson, technical manager, Remploy Electronics, commented: “With a 457 x 508mm maximum board size and minimum component size of 0201, these AOI systems will ensure high quality levels are maintained on all products as Remploy continues to increase its manufacturing throughput. The intuitive programming interface, and ability to inspect boards after assembly or wave soldering, will enable us to implement testing procedures that are both timely and flexible.”



The new equipment complements Remploy’s existing test facilities that include a Flying Scorpion FLS 450 in-circuit tester. This enables PCB assemblies to be tested automatically and simultaneously on both sides for production in-circuit test and component faults. Simple and cost-effective to set up, it tests active and passive components and is particularly suitable for boards featuring fine pitch and flip chip technologies.