3D AOI at SMTA International
Nordson YESTECH will exhibit at SMTA International and will demonstrate the FX-940 ULTRA 3D AOI with 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices.
With Advanced Fusion Lighting and comprehensive inspection tools including angled cameras, full-colour digital image processing and both image and rule-based algorithms, the FX-940 ULTRA offers complete inspection coverage with 2D and 3D defect detection. The FX-940 ULTRA features 12 MP / 5 axis 3D NYTVISION technology, complete 2D + 3D inspection capabilities and one top-down and four side-viewing cameras.
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