XENSIV 3D magnetic sensor family brings new options

It uses the latest 3D Hall generation from Infineon and is housed in an extremely small wafer-level package. With an 87% smaller footprint and 46% less height than previous comparable products, the sensor opens up new design options.

Due to the small WLB-5 package (1.13x0.93x0.59mm) and its low current consumption of 7nA in power-down mode, the new magnetic sensor is also suitable for use in applications that previously used resistor-based or optical solutions. Magnetic sensors offer numerous advantages here, such as their high accuracy or robustness against dust and moisture. In addition, magnetic sensors are easier to assemble and offer more design options.

In particular, the low height of the TLI493D-W2BW is helpful in extremely space-critical applications such as BLDC commutation in micromotors or control elements such as joysticks or game consoles. It enables designs with double-sided PCBs or positioning of the sensor between two PCBs. This allows optimal use of the available space; for example, additional components can be placed above the sensor.

The new sensor has an integrated wake-up function. It is available in four variants with preconfigured standard addresses. A higher resolution (typ. 32.5 to 130 µT/LSB12) compared to the previous generation extends the range of applications. XY angle measurement is also supported.

The update rate is up to 5.7kHz (8.4kHz for XY), while the resolution in low-power modes can be adjusted in eight steps between 0.05 and 770Hz. Power consumption in power-down mode is specified at 7nA. The supply current is 3.4mA. The sensor has an I2C interface and a dedicated interrupt pin.

Samples of the new XENSIV 3D sensor TLI493D-W2BW are already available. Series production will start in August 2020.