Search results for "ASIC"

Semtech Corporation has announced that the company has successfully completed electrical compliance testing of its Snowbush 28nm Platform Physical Layer IP, in support of the Hybrid Memory Cube (HMC) specification for ultra fast, next-generation memory.

Barco Silex has announced the launch of its AES-GCM (BA415) IP core for 10-100Gbps applications. The AES-GCM (Galois Counter Mode) is an authenticated encryption algorithm which combines the AES counter mode for encryption and the Galois field multiplier for the authentication.

Suitable for consumer applications with a high degree of electronics integration and multi-functionality, the IPPS-015-1000hPa pressure sensor has been announced by Pewatron. This MEMS piezo-resistive pressure sensor chip and signal-conditioning ASIC are integrated into a compact and thin package measuring 4.5x4.0x1.0mm.

Advantest has announced its new T2000 Enhanced Device Power Supply 150A (DPS150AE) module that enables its T2000 test platform to handle the load requirements for highly accurate testing of both high-current and low-voltage semiconductors, including microprocessor units (MPUs), application-specific ICs (ASICs) and field-programmable gate arrays (FPGAs).

The Ericsson 3E series BMR464-50A is a third-generation digital point-of-load (POL) regulator that features Dynamic Loop Compensation (DLC) and also extends output current up by 25% to 50A from the 40A offered by the BMR464-40A, yet it comes in a fully compatible footprint. Embedding the latest Dynamic Loop Compensation technology, the BMR464-50A runs the DLC algorithm as default following the enabling of the output.

Texas Instruments introduces the industry’s first 18-V, 20-A and 30-A synchronous DC/DC buck converters with PMBus interface. The SWIFT TPS544B20 and TPS544C20 converters feature small QFN packages and integrated MOSFETs to drive ASICs in space-constrained and power-dense applications in various markets, including wired and wireless communications, enterprise and cloud computing, and data storage systems.

A new solution for Boundary Scan test of DDR3-DIMM sockets has been developed by GOEPEL electronics. The CION Module SO-DIMM204-3/ECC is simply plugged into the test socket and allows the structural test coverage of DDR3 memory interfaces. All signal pins as well as almost all Ground-Pins can be tested via Boundary Scan.

Applications in the industrial, transportation, medical, military and aerospace industries are the target for Honeywell’s SMART position sensor now available from Aerco. The durable and adaptable non-contact sensors provide accurate, safe and efficient motion control. The SMART (Superior Measurement, Accuracy, Reliability, Thinking) sensors are small and lightweight.

Targeted at designers who need tomodel new systems faster and more accurately,3D STEP files of all CT-Concept Technologie's SCALE-2 IGBT gate drivers have now been made freely available.3D interactive models of the company’s drivers are also included in new application manuals.

TheISL8240Mpower module has been launched by Intersil, with the company claiming the devicesets a new standard for efficiency and power density in infrastructure and embedded computing applications. Thedual 20A/single 40A step-down power module deliversup to 100W of output power in a 2.9cm2 footprint, whilst also providing more than 90%power efficiency.