Search results for "ASIC"
The ultimate in precision and efficiency
Modern Brushless DC (BLDC) motor controllers that are housed in compact assemblies are ideal for integration into systems that require precision control and efficiency. This enabling technology fulfils the requirements of both simple and complex motor systems, while offering significant advantages and improving time to market. By Don Laskay, Data Device Corporation.
When will 3D TSV be used for mainstream consumer applications?
Yole Développement has released a new report '3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update' which provides an overview of the TSV implementation for various devices and packages including memories, logic, MEMS, photonics, CIS and other applications.
The 4th workshop on PowerSoC to be held in October
The 4th International Workshop on Power Supply on Chip (PowerSoC2014) will be held at Northeastern University Boston MA on October 6-8, 2014. The Power Sources Manufacturers Association (PSMA) and IEEE Power Electronics Society (IEEE PELS) are jointly sponsoring, and the College of Engineering (COE) of Northeastern University (NEU) is hosting the workshop.
Board-mounted sensors meet pressure challenges
Today’s liquid-compatible, board-mounted sensors are meeting the challenges involved with pressure sensing in high-humidity environments. By Bryan Hovey, Product Manager, Pressure and Thermal, Honeywell Sensing and Control.
Switching controller simplifies POL supply designs
Supporting point-of-load (POL) supplies from industrial 24V DC and 24V AC rectified sources, the XR75100 synchronous step-down controller has been introduced by Exar. This 40V switching controller delivers core voltage rails for ASICs, FPGAs, DSPs and other various processors in medical, automotive, instrumentation and a variety of other industrial markets.
Synopsys Redefines the IP Supplier Paradigm with New IP Accelerated Initiative
Synopsys, Inc announced the IP Accelerated initiative to help designers significantly reduce the time and effort of integrating IP into their system-on-chips (SoCs). This initiative augments Synopsys' established broad portfolio of silicon-proven DesignWare IP with the addition of new IP Prototyping Kits, IP Virtual Development Kits and customized IP subsystems to accelerate prototyping, software development and integration of IP into SoCs. With ...
Synopsys Announces HAPS Connect Program to Speed Creation of HAPS FPGA-Based Prototypes
Synopsys, Inc announced the launch of its HAPS Connect Program to broaden hardware and service offerings for Synopsys HAPS prototyping systems. Back9 Design, eInfochips, Fidus, Gigafirm, hd Lab and Sarokal are the first companies to sign multi-year agreements to provide daughter boards, mechanical design services and protocol testing for Synopsys HAPS systems.
Test solution meets USB 3.1 challenges
Agilent Technologies has launched a test solution for characterising USB 3.1 receivers. Using the Agilent USB 3.1 receiver test set, design and test engineers in the semiconductor and computer industry can now accurately characterise and verify USB 3.1 receiver ports in ASICs and chipsets.
It’s all in the timing
With the complexity of modern technology rising, semiconductor manufacturers are increasingly providing tools to equip digital design engineers with the know-how they need to achieve system-level results. By Ian Dobson
IP Core performs a serial-to-parallel conversion
DCD’s UART IP Core performs a serial-to-parallel conversion on data characters received from a peripheral device or a MODEM. And for those who need more, the D16950 enables also parallel-to-serial conversion on data characters received from the CPU. The processor can read a complete status of the UART at any time during the functional operation.