Search results for "pcb"
Aavid Thermalloy to Globally Distribute Heat Sink and Attachment Products
Aavid Thermalloy has signed a distribution agreement with Advanced Thermal Solutions, Inc., a leader in innovative component cooling solutions. Aavid Thermalloy, with its global customer base and broad network of sales offices, representatives and distributors, will now have access to ATS’ high performance heat sink and attachment technologies to address the cooling of today’s and tomorrow’s electronic devices.
Clip-On Heat Sink Assembly Improves Thermal Peformance
Advanced Thermal Solutions has announced the introduction of superGRIP, a new two-component, attachment system which quickly and securely mounts heat sinks to a wide range of hot running Ball Grid Array (BGA) components, while using a minimal amount of space on the PCB and eliminating the need to drill holes.
Digi-Key and Advanced Thermal Solutions Sign Worldwide Distribution Agreement
Advanced Thermal Solutions, Inc. (ATS) has partnered with Digi-Key, the global electronic components distributor, to offer over 380 heat sinks for cooling BGAs and other hot-running semiconductor devices. The heat sinks are available for immediate delivery when purchased through Digi-Key’s Web site and printed catalogs. Design engineers can obtain individual ATS sinks for prototypes and testing, or larger volumes for production requirements. D...
NEC Electronics, Viaccess and 27M Technologies reduce time to market of Pay TV set top box designs
NEC Electronics, a leading developer and supplier of semiconductor products, Viaccess, a leader in conditional access for pay television and protection of digital content over broadcast and broadband networks, and 27M Technologies, a hardware and software design house expert in the field of STB and DTV, announced today the availability of a complete cost optimized manufacturer’s kit based on NEC Electronics’ EMMA2SL and EMMA2SL/P MPEG2 Digita...
IR Introduces Rugged Reliable AUIPS7221R Intelligent Power Switch with High Frequency PWM Capability
International Rectifier has introduced the AUIPS7221R 65 V high-side intelligent power switch with fully integrated bootstrap function for fast actuator applications including fuel magnetic injectors and braking valves.
Energy-efficient Industrial TFT Displays Offer Outstanding Sunlight Readability
Densitron has introduced a new range of industrial grade TFT displays that is highly energy-efficient and offers excellent sunlight readability. The new series is available in 2.2”, 2.7”, 3.5”, 4.3”, 5”, 5.7” and 6.5”. They come with long-term availability guarantee and touch screen options.
Wide Range of Sophisticated TFTs for Diverse Industrial Applications & Design Budgets
Densitron has just added 10 new models to its already extensive range of 2” to 7” industrial grade Seiko Instruments (SII) TFTs. The series utilizes SII-unique and advanced LCD technologies to provide display solutions that are optimal both in terms of cost and performance for different applications, and comes with long-term availability guarantee and touch screen options.
Verotec's KM6 subrack family is suitable for practically every application
Verotec’s KM6 subrack family is arguably the most comprehensive and versatile system available. Originally developed by Vero Electronics, it has continually evolved over time to reflect the changing demands of the electronics industry. All four main elements of the KM6 range: KM6-II, -RF, -EC and –HD167 offer an unrivalled combination of strength, versatility and configurability; each range is optimised to suit a specific application or pri...
Versatile desktop and caseframe enclosures from Verotec
The comprehensive range of elegant Diplomat 19 and half-width desktop cases, 19 vertical and horizontal caseframes from Verotec offers outstanding versatility and thermal management. Available in 3U, 4U, 6U and 9U heights and depths of 322, 422, 522 and 622mm, the Diplomat is equally suitable for use during system development and as a housing for production status units.
Power Modules with Additional Low Inductive Current Path
Parasitic inductances are a major problem with power modules, in particular in fast switching applications. The parasitic inductance of the component interconnections causes an overvoltage condition and increases the switch-off losses in the semiconductor. Many initiatives have been investigated to reduce the parasitic inductance in power modules utilizing a complex mechanical construction of overlapping internal bus bars forming the DC path.