Search results for "pcb"
PCB Protection with Master Bond’s Conformal Coating
As conformal coatings are becoming more essential to electronic assemblies, Master Bond broadens their protective conformal coatings line with the addition of UV10LV. A clear, highly non-conductive, UV curing conformal coating, it is designed to restrain the impact of moisture, dust, chemicals, and temperature extremes on electronic circuitry and components. I ts high resilience bonds will not deteriorate even when exposed to adverse environmenta...
PCB Conformal Coating Features Fast Tack Free Cure
Moisture-curing silicone conformal coatings are ideally suited as protective coatings for sensitive board components in demanding environments. However, electronic manufacturers avoided the use of silicone coatings in electronic packaging due to their long cure schedule that did not allow rapid assembly. Master Bond has developed a rapid tack free, ready-to-use silicone conformal coating called Master Sil 773, formulated to provide excellent pro...
XMOS releases new package and pricing on XS1-G4
XMOS has released a new package option for the G4 programmable device, the first member of the XS1-G4 family. The new 144-pin BGA package option is designed for systems that require the smaller form factor (11mm square). With a .8mm ball pitch it is ideal for compact designs and simple PCB layout. For designs that require a full complement of 256 I/O pins a 512-pin BGA package is available.
Labtech Microwave celebrates its 25th anniversary
Labtech Microwave, one of the UK’s leading design and manufacturers of microwave solutions and bespoke microwave component technology, celebrates its 25th anniversary in 2009.
AS 9100 B certification awarded to Dongguan Somacis Graphic
Driven by Aerospace and Avionics market opportunities, Dongguan Somacis Graphic (DSG) has successfully achieved the AS 9100 certification for the manufacture and sale of Rigid and Rigid Flex printed circuit boards.
CAD Tool - EAGLE allows instant price check and availability, enabling design engineers to automatically add parts to a shopping cart directly from a schematic
CadSoft Computer GmbH, a fully owned subsidiary of Premier Farnell plc (LSE:pfl), the leading multi-channel, high service distributor, has announced the launch of EAGLE software version 5.11. This latest version of the award - winning EAGLE software, the best selling CAD tool of its kind, incorporates new “DesignLink” functionality, giving electronic design engineers (EDEs) automatic search through element 14, with online check of pricing and...
CadSoft launches EAGLE version 6
CadSoft Computer GmbH, a part of Premier Farnell plc (LSE:pfl), today announces the launch of version 6 of its easy-to-use ‘EAGLE’ PCB software for professional board design. CadSoft EAGLE Version 6 is available to buy from today and focuses on flexibility and enabling users to save time by optimizing and integrating new features such as BGA escape routing, differential pair routing, automatic meanders and undo/redo logs. Additionally this la...
element14 to auction ‘electronics waste sculpture’ at electronica to benefit charity
element14, Premier Farnell’s innovative online technology resource and community for electronic design engineers, and a leading authority on environmental legislation in the electronics industry, announces it will auction off its ‘electronics waste sculpture’ built over this week’s four day electronica event, 9-12 of November. The building of the sculpture can be watched via an exclusive web cam available through the element14 website at...
Farnell element14 to demonstrate latest end-to-end embedded design solutions at Embedded World
Farnell element14 has announced some of its plans for this year’s Embedded World exhibition in Nuremburg, Germany. The company will be demonstrating its latest embedded design solutions including software development tools, development boards, ARM based designs, PCB Design software and fabrication services that support developers from initial specification through to final prototype.
Low Profile Heat Sinks Cool Hot Components In Constricted Packages
Advanced Thermal Solutions introduced a line of lower height maxiFLOW heat sinks for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heat sinks feature a spread fin array that maximizes surface area for more effective convection (air) cooling. Standard sink heights are as low as 9.5 mm.