Search results for "pcb"

Essemtec will highlight a Swiss Made, high quality SMD assembly line at the upcoming Electronica India, taking place at Bangalore International Exhibition Centre (BIEC) from September 7-10, 2010. Essemtec's solutions combine latest placement technology, Swiss quality and high flexibility with affordable prices. Essemtec’s booth will be at hall 1, lower level, booth 1230.

Essemtec announces that it will feature a range of new equipment in Booth #773 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Combining an automatic SMD pick-and-place for series production with a semiautomatic placer for prototyping proves beneficial. A universal data interface developed by Essemtec ensures an easy, secure transition from prototyping into production and avoids confusion about data versions.By Adrian Schärli, Azular GmbH, for Essemtec AG

Fourth generation ePlace software makes operating an SMD pick-and-place machine easier while saving both time and money. Due to Windows 7 and an SQL database, the system is simpler to integrate as well. ePlace 4.0 is the most modern graphical user-machine interface from Essemtec. Currently, various SMD placement machines are compatible with ePlace, including Paraquda and Cobra.

“Paraquda” from Essemtec is the world’s most modern SMD pick-and-place machine. New materials used lead to higher quality and a new high-speed control system provides both higher speed and higher precision. The Paraquda features ultra short changeover times, a new intuitive operation system Eplace and an integrated quality management system that reduces manufacturing costs for electronics. Essemtec will premier the new machine at the upcomi...

Littelfuse introduced its new 977 Series of ceramic body, 5x20mm-size fuses designed for circuit protection in both high-power AC and power-efficient DC applications. The 450VDC rating of the 977 Series sets it apart from other manufacturers’ fuse products.

ADATA have today revealed the start of shipments of the XPG Gaming v2.0 Series DDR3 2400G DRAM modules. These dual channel kits are designed and engineered to bring optimum performance to third generation Intel Core processors and the Z77 platform.

ADATA Technology, one of the world’s leading manufacturers of high performance DRAM modules and NAND Flash application products, today announced an expansion of its XPG Gaming Series V2.0 product line with high capacity DDR3 memory modules, the DDR3 1866MHz and 2133 MHz.

Noritake Itron’s TU480X272C-K612A1T intelligent iSMART 4.3in TFT analogue touch screen module features a fast access, 100 page display memory with re-usable display pages and menus. A raft of applications range from elevators to processing and temperature and climate control.

Binder UK, the newly formed subsidiary of Franz Binder, the German connector manufacturer, now supplies an enhanced version of the Series 766 range of M12 B-coded connectors that is available with bulkhead sockets pre-terminated on 0.5m Profibus cable.