Search results for "pcb"

Atmel Corporation has announced the availability of two stand-alone LIN (local interconnect network) transceiver ICs in DFN packages. Compared to standard SO8 packages at 5mm x 6.5mm, the DFN14 package for the ATA6670 measures at 3mm x 4.5mm, while the DFN8 package for the ATA6663 measures at 3mm x 3mm, saving about 75 percent of the overall PCB area. Space and cost savings are critical for LIN bus networking applications such as automotive body ...

Infineon Technologies announced the availability of XMM™6260, the latest platform in its 3G slim-modem family. The XMM 6260 platform is optimized as a slim-modem for smart phone architectures coupled with an application processor or as a standalone solution for PC modems and data cards. This advanced HSPA+ platform is based on two new highly integrated Infineon devices: the X-GOLD™626 baseband processor and the SMARTi™UE2 Radio Frequency (R...

Texas Instruments Incorporated has announced a sub-1 GHz radio frequency (RF) value line plug-in-board for TI’s MSP430™ microcontroller LaunchPad development kit. The new 430BOOST-CC110L RF BoosterPack includes ETSI-compliant and FCC-certified modules to help speed development time, reduce certification costs and eliminate barriers associated with the RF hardware design process.

Texas Instruments Incorporated today unveiled the SimpleLink product family, the industry’s widest portfolio of easy-to-use wireless connectivity technologies for low-power, low-cost embedded applications. The SimpleLink family includes self-contained wireless processors, aimed at enabling easy integration with any embedded system.

Murata and Beta LAYOUT today announced the launch of an RFID starter kit based on Murata’s MAGICSTRAP UHF passive RFID devices. Aimed at engineers and developers wishing to quickly learn about and incorporate RFID into their electronics design, the kit comprises a reader/writer board, communication software, two reader antennas and four different kinds of MAGICSTRAP RFID tag modules.

Mobile device designers are faced with changing standards and a need to increase battery life, and extend talk and data transmit time. In order to help designers address these challenges, Fairchild Semiconductor has developed a power management product for the RF portion of mobile handsets and tablets.

The RN-42 from Roving Networks is functionally compatible with the RN-41. The primary difference between the RN-42 and RN-41 is that the RN-42 is a Class 2 device, meaning its range is about 50 to 60 feet and correspondingly the power consumption is reduced. The RN-42 is perfect for short range, battery powered applications and by default is ready to use in the SPP configuration. The RN-42 uses only 26uA in sleep mode while still being discoverab...

Atheros Communications, Inc. has announced SmartLink™, a new technology that enhances the performance and coverage of powerline technology by transferring data across all three electrical wires—line, neutral and ground. Analogous to Wi-Fi switched antenna diversity, this new offering increases data throughput and is able to deliver carrier-grade multiple HD video streams within a single home.

Essemtec announces that it will showcase flexible Swiss-made solutions in Booth #1617 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

Perfect solder paste printing is neither coincidence nor witchcraft, but a question of the correct materials and technologies. Essemtec, Koki and Koenen are organizing a printing technology day that will highlight the interaction of paste, stencil, machine and design. The event takes place in Maarssen, Netherlands, on September 30th, 2009 and is free of charge.