Search results for "chips"
Where is the NFC chip on a passport?
TheNFC chipis embedded securely within a passport, typically on the back side of the front cover.
Infineon expands its Bluetooth portfolio with eight new parts
Infineon has announced the expansion of its Bluetooth portfolio by eight new products in the AIROC CYW20829 Bluetooth Low Energy 5.4 MCU family, featuring Systems-on-Chip (SoCs) and modules optimised for industrial, consumer, and automotive use cases.
How long will Moore’s Law last?
Moore’s Law states that the number of transistors on a microchip doubles approximately every year, but how long will Moore’s Law last?
SEMI and Policy Equity Group fund initiative for semiconductor child care gaps
Seeking to bolster the semiconductor industry workforce in the US by addressing gaps in child care needs, the SEMI Foundation and Policy Equity Group have announced a collaboration to help companies comply withchild care requirementsunder the US CHIPS and Science Act.
Swissbit hosts EuroPAT Workshop 2024
The EuroPAT Workshop 2024 is to be hosted by Swissbit, September 9th-10th, in Berlin, Germany, under the SEMI Europe umbrella.
Intel cuts 15,000 jobs amidst massive shares losses
US chip-maker Intel planned to cut over 15,000 jobs as part of a major restructuring effort aimed at reviving its business and competing with more successful rivals such as Nvidia and AMD. This reduction represented about 15% of the company's workforce and was intended to save $10 billion by 2025, reflecting efforts to align its cost structure with a new operating model.
UK startups raise £10 million through ChipStart programme
Eleven semiconductor startups focusing on enhancing AI efficiency and developing innovative healthcare technologies have joined a government-supported initiative designed to transform their research into commercial success.
Weebit Nano and DB HiTek tape-out ReRAM module
Weebit Nano and DB HiTek have released to manufacturing a demonstration chip integrating Weebit’s embedded Resistive Random-Access Memory (ReRAM) module in DB HiTek’s 130nm Bipolar-CMOS-DMOS (BCD) process.
TE Connectivity GEMnet with TI’s FPD-Link IV
TE Connectivity (TE) has equipped its GEMnet connector system to work with Texas Instruments’ FPD-Link IV SerDes semiconductors to transmit high-resolution, uncompressed video and bidirectional control over lightweight cable assemblies and connectors in the automotive environment with near-zero latency.
Nordson Electronics Solutions completes Europe location move
Nordson Electronics Solutions has announced that its Nordson B.V. division, which covers Europe, the Middle East, and Africa, has consolidated its offices into one site in Valkenswaard, The Netherlands, in early July.