Search results for "EDA"

MOSIS, a provider of low-cost prototyping and small volume production services for custom ASICs, announces a strategic agreement with SEMPAC that will enable the company to offer customers a low-cost alternative to ceramic packages for VLSI circuits. The deal will give customers who use the MOSIS multi-project wafer (MPW) service access to QFN/MLP, QFP and SOIC/SSP packages from SEMPAC's Open-Pak product line. These pre-molded, air cavity package...

Tensilica has announced its new TurboXim fast functional simulator, which is 40 to 80 times faster than its proven cycle-accurate ISS (Instruction Set Simulator). Tensilica also introduced its ability to automatically generate SystemC models to match all possible configurations of its Xtensa configurable processors and Diamond Standard series processors. These introductions significantly speed ESL (embedded system level) design and architectural...

Zetex, the analogue semiconductor company, has announced that Dr. Riedlberger, an accomplished semiconductor industry veteran, is to head its technology department. “This is another important milestone for Zetex, demonstrating our determination to put a world-class team in place to excel in achieving our ambitious goals,” said Chief Executive Hans Rohrer. “Franz brings a wealth of knowledge to the company, both in semiconductor technology ...

Orange Tree Technologies, a board-level embedded hardware and software company focused on high performance system-host communications interconnect, today announced that it has joined the Xilinx Alliance Program. The announcement comes on the back of Orange Tree’s record sales performance in the Industrial segment. Participation in the Program is a demonstration of its commitment to supporting the increased use and market deployment of low p...

In2Connect UK Ltd work with many world class manufacturers of interconnects for PCB and Backplanes ~ board to board, wire to board and card edge ~ including Conec, ept, ITW McMurdo, Nicomatic, Sullins and EDAC.

The European and American rally of Zuken’s annual conferences is now officially over, and despite the tough economic climate, a massive audience of over 700 people collectively attended the events in France, Germany, Italy, Switzerland, UK and the USA.

Aldec, Inc., in collaboration with SynthWorks Design Inc., today announces the availability of Open Source - VHDL Verification Methodology (OS-VVM™), underscoring the partnership’s commitment to provide continued support to the VHDL design community.

Synplicity has announced the signing of a definitive agreement to acquire all of the outstanding shares of HARDI Electronics AB, a leading developer of off-the-shelf ASIC prototyping boards, for $24.2 million in cash. The ASIC prototyping market is one the fastest growing segments of the EDA industry, and this acquisition makes Synplicity the leader in this part of the ASIC verification market.

Toshiba Electronics Europe’s ASIC & Foundry Business Unit has launched two new mixed-signal IP cores that will simplify and speed integration of LVDS (low-voltage differential swing) transmitter and receiver functionality into system-on-chip (SoC) designs for flat panel display (FPD) applications.

Toshiba Electronics Europe (TEE) has announced a new system-on-chip (SoC) design and verification platform that will significantly shorten ASIC and ASSP development time. The CPS (Chip-Package-System) co-design/co-verification platform supports the rapid identification of the optimum SoC package as well as delivering the cost/performance benefits and improving verification accuracy prior to hardware prototyping.