Search results for "ASIC"

Semiconductor manufacturers regularly announce the planned obsolescence of older products, to direct their resources towards supporting new product introductions with the latest technologies. The effects of these natural cycles challenge OEMs to ensure the sustainability of their products. This is especially true in high reliability, long life cycle products in sectors such as medical, industrial, transportation telecomms-infrastructure or aerosp...

Cortus has announced the availability of a development platform for its APS processor cores. The Cortus development platform comprises a board based on a Xilinx Spartan-6X75, the Cortus Eclipse IDE and the Cortus GCC toolchain. The board includes an I/O footprint compatible with the Arduino Due, enabling the wide choice of Arduino Due-compatible shields to be used to extend the platform.

Synopsys has announced that Toshiba and Nationz, a Chinese chip provider, have both successfully deployed Synopsys' PrimeRail tool as the standard power and rail analysis solution for implementation and signoff. The adoption of PrimeRail dynamic analysis in Nationz' design and signoff methodology enabled engineers to accurately capture peak power and voltage drop violations accounting for transient circuit behaviour.

The foundry division of ams AG, Fraunhofer Institute for Integrated Circuits IIS and the Space Research Institute (IWF) of the Austrian Academy of Sciences (OeAW) have jointly presented the very promising results of highly accurate measurements of the Earth’s magnetosphere from space, as part of NASA’s ‘Magnetospheric Multiscale’ mission launched in March 2015.

An ASIC with on-chip Hall sensing elements improves the offset and offset drift compared to former circuits improves the performance of closed-loop current transducers. Fabrice Salvi, LEM, explains.

Low power, flash-based FPGAs and ARM Cortex-M3 enabled SoC FPGAs, which have achieved AEC-Q100 grade 2 qualification, have been released by Microsemi. According to the company, the automotive-grade qualified SmartFusion2 and IGLOO2 devices are the only devices in the industry to offer advanced security and high reliability features critical for automotive applications.

IQD’s QXT-260 series of digitally compensated TCXOs, which are housed in a small 2.0x2.5x0.8mm ceramic package, is being launched at IMS 2015. The device employs an analogue ASIC for the oscillator and a high order temperature compensation circuit that provides a smoother signal.

The industry’s first fully software-programmable DFE (Digital Front End) SoC for cellular base station radios has been introduced by Freescale Semiconductor. The AFD4400 virtually eliminates hardware logic design, allowing integrators to concentrate on software development and product integration.

Integrating an N-channel and a P-channel MOSFET, the DMC1028UFDB complementary MOSFET pair has been introduced by Diodes Incorporated. Aimed at increasing the power density of DC/DC converters, the DMC1028UFDB is customised for PoL converters that step down from 3.3 to 1V for core voltage supply to ASICs.

A dual 18A or single 36A µModule regulator with high precision output voltage regulation for 28nm and sub-28nm FPGAs, ASICs and MPUs has been released by Linear Technology. The core voltage of these advanced digital devices requires very accurate voltage regulation at steady state (DC) and at fast load current transients.