Search results for "thermal"

Axiomtek, a global pioneer of research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products, is excited to unveil theCEM710, a server-class COM Express Type 7 basic module powered by the Intel Xeon D-1700 processor (Ice Lake D) with up to 10 cores, integrated AI acceleration, and support for hard real-time workloads.

MIPS, a developer of efficient and configurable IP compute cores, announces the general availability (GA) launch of the MIPS P8700 Series RISC-V Processor. Designed to meet the low-latency, highly intensive data movement demands of the most advanced automotive applications such as ADAS and Autonomous Vehicles (AVs), the P8700 delivers accelerated compute, power efficiency, and scalability.

Nisshinbo Micro Devices has announced the launch of the NA1150, an audio switching driver designed for automotive applications.

Digitalisation, AI, and automation are intensifying demands on data centre (DC) IT infrastructure, driving the need for effective cooling solutions.

With immediate effect, Rutronik is offering ceramic capacitors with a particularly high degree of safety with the MLCCs of the SC and ST series from YAGEO.

CeramTec will be showcasing its range of solutions under the motto "Let's Talk Ceramics!" at electronica 2024, stand 429 in hall B5.

Flex Power Modules introduces the BMR352, a new generation of non-isolated fully regulated DC/DC converter offering the highest peak power capability in a quarter-brick form factor.

Authorised distributor Mouser Electronics is now shipping the HybridPACK Drive G2 modules from Infineon Technologies.

For the first time, Intel Core i processors with up to eight E-cores are now available on SMARC Computer-on-Modules. This allows even the smallest fanless low-power systems for extended temperature ranges to benefit from extremely powerful AI inference logic and enhanced virtualisation options, improving cyber security among other advantages.

In the dynamic world of optoelectronics, where light and electronics come together, connection technology plays a crucial role in the performance and lifespan of laser diodes (LD) and photodiodes (PD). Tresky is offering customised solutions that are specially tailored to the requirements of DIE bonding of laser- and photodiodes.