Search results for "EDA"

Siemens Digital Industries Software announces Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D and 3D technologies and substrates in the world.

CEA-Leti is delighted to announce the inaugural meeting today of the FAMES Pilot Line, a project designed to propel semiconductor technologies in Europe forward.

Nanusens has announced that Sandhiprakash (Sandhi) Bhide has joined the company as a business advisor.

Synopsys has expanded its collaboration with Arm to provide optimised IP and EDA solutions for the newest Arm technology, including the Arm Neoverse V2 platform and Arm Neoverse Compute Subsystem (CSS).

Siemens Digital Industries Software has announced that Stanley Electric, a pioneering automotive electronics company, has adopted Siemens’ Questa Advanced Verification platform as the integrated circuit (IC) functional design verification environment for the design of Stanley’s next generation microelectromechanical systems (MEMS) device.

Keysight recently held a webinar titled: “Overcoming Design Challenges in the Era of Wide Bandgap Semiconductors,” in which valuable insights on the trends and challenges of power electronics were explored.

Keysight Technologies, Synopsys, and Ansys announced a new reference flow for the TSMC N4PRF, the semiconductor foundry’s advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.

Siemens Digital Industries Software has announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of Siemens EDA product lines for the foundry’s latest process technologies.

Keysight Technologies, Synopsys, and Ansys have announced a new reference flow for the TSMC N4PRF, the would number one semiconductor foundry's advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.

Synopsys has announced it is extending its collaboration with TSMC to advance multi-die system designs with a comprehensive solution supporting the latest 3Dblox 2.0 standard and TSMC’s 3DFabric technologies.