Search results for "Toshiba"

Toshiba Electronics Europe has revealed that its high-efficiency, low-voltage MOSFETs are now available in ultra-compact DSOP Advance package options, which offer dual-sided cooling to improve heat dissipation by more than 30%. This enables designers to minimise the PCB temperature and improve performancewithout board space penalties in high-component-density applications.

Suitable for applications including inverter interfaces and general-purpose power supplies, a transistor output photocoupler has been introduced by Toshiba Electronics Europe. TheTLP385 offers a high isolation performance, guaranteeing a minimum isolation voltage of 5kVrms.

Supporting hi-res multimedia connectivity and camera devices with ethernet AVB standard, Toshiba has introduced the TC358791XBG automotive companion chip. The AEC-Q100 Grade 3 qualified chip, features differential CVBS interfaces for analogue composite video sources, support for early back-up camera view (CVBS to LVDS) and the ability to relay packetised IQ audio tuner data to the host via USB.

Suitable for applications such as home appliances, inverters, factory automation and control equipment, ToshibaElectronics Europe has introduced two photocouplers. The TLP5701 provides a peak output current of ±0.6A which makes it suited for low-power IGBTs and power MOSFETs, while the TLP5702's ±2.5A peak output current makes it suitable for driving medium-power devices.

Enabling compact design and quiet operation in applications such as home appliances and office automation equipment, Toshiba Electronics Europe has introduced four motor driver ICs. TheTB67S269FTG bipolar stepping motor driver provides 50V and 2A forprinters, office automation equipment, ATMs, amusement machines and home appliances.

Toshiba Electronics Europe has launched what it claims to be the world’s smallest-class of embedded NAND flash memory products integrating NAND chips fabricated with cutting-edge 15nm process technology. The e-MMC NAND chips are designed for applications including smartphones, tablets and wearable devices.

Comprised of a Bluetooth Low Energy (BLE) IC, MCU, sensors and associated software, Toshiba Electronics Europe has announced a starter kit. The TC35667FTG BLE IC integrates a highly efficient DC/DC converter in a low-power circuit design, reducing peak current consumption to less than 6mA and deep sleep current consumption to less than 100nA.

The Semicast study 'Opportunities for ARM in Embedded Processing' suggests that shipments for ARM in IoT applications are set to grow to about 12bn units in 2018, from fewer than 3bn in 2010 and under 1bn in 2006. Units for ARM-based MCUs in IoT applications are forecast to grow at a compound annual growth rate of 32% from 2010 to 2018, compared with 11% for ARM-based SoCs.

Helping engineers analyse the performance of components for the power stages of embedded designs, Toshiba Electronics Europe has launched the 'Toshiba Semiconductor Web Simulator'. This online design tool also helps to improve overall system effectiveness and efficiency.

Targeting high-end mobile handsets and smartphones with 1080p resolution, Toshiba Electronics Europe introduces a 1.12μm CMOS image sensor with an optical height of 1/2.4". The T4KA7 sensor enables engineers to develop camera modules with a z-height of 6mm or less for ultrathin and ultralight mobile devices.