Search results for "Toshiba"

Wireless charging provides a convenient way for users to charge all their mobile devices simultaneously, as a result deployment is growing. By David Zelkha, Managing Director, Luso Electronics

As consumers start demanding more connected cars, multiple wireless networks including Bluetooth and WiFi must coexist within the vehicle. Semiconductor integration holds the key to ensuring interoperability within tight cost, size and power constraints. By Heiner Tendyck, Principal Engineer for Solution Marketing and Strategic Business Planning, Toshiba Electronics Europe.

Enabling over 50 successful tapeouts in the nine months since it became generally available, Synopsys' PrimeTime ADV advanced timing closure and signoff solution has been adopted by more than 70 leading semiconductor companies. According to Synopsys, the key to its adoption is ease of integration into existing timing closure flows, fast turnaround time and the ability to reduce timing Engineering Change Order (ECO) iterations on designs.

Integrating an N-channel IEGT (Injection-Enhanced Gate Transistor) and an SiC fast recovery diode, the MG1500FXF1US71 high-efficiency 3300V, 1500A power module has been introduced by Toshiba Electronics Europe.

Toshiba Electronics Europe has expanded its line-up of image recognition processors with the launch of the TMPV760 series. Supported by 14 hardware-based image recognition accelerators, the first device in this new series will support the implementation of next generation Advanced Driver Assistance Systems (ADASs).

Designed to protect equipment attached to communication lines, an ESD protection diode has been introduced by Toshiba Electronics Europe. The DF5G7M2N protects high-speed interfaces such as USB3.1, HDMI, DisplayPort and Thunderbolt from static electricity, as well as shielding small portable devices such as smartphones and tablets from ESD events.

Toshiba Electronics Europe (TEE) has launched the industry's first VESA’s embedded Display Port (eDP)-to-MIPI dual-DSI converter chipset. The new TC358860XBG chipset enables 4K2K ultra high definition (UHD) experiences on handheld electronic devices such as tablets, phablets and portable gaming systems.

With the launch of the TZ1021MBG application processor, Toshiba has expanded its ApPLite family. Applications for the device include activity monitors, smart watches, smart-wristbands and smart-glasses, as well as other wearable products.

According to Yole Développement, 3D TSV integration has already been adopted in MEMS and CMOS Image Sensors for consumer applications. Device makers such as Sony, Toshiba, Omnivision, Samsung, Bosch Sensortec, STMicroelectronics and mCube have all brought devices to the market that integrate 3D TSV technology.

Based on the company's high voltage DTMOS IV super junction technology, Toshiba Electronics Europe announces an 800V power MOSFET. The TK17A80W is suitable for equipment that requires high reliability, power efficiency and a compact design, such as power supplies and adapters, fly back converters and LED lighting equipment.