Search results for "6G"
Motherboard designed with flexibility & versatility in mind
GIGABYTE Technology has introduced the MW70-3S0,its latest dual socket workstation motherboard based on the IntelC612 chipset. It joins the single socketMW50-SV0to complement GIGABYTE's line of2011-3 socket based workstation motherboards, and offers workstation builders a high end product featuring the latest technologies and the most reliable components.
RF connectors offer performance in micro-miniature designs
Amphenol RF introduces its ultra-miniatureAmphenol Micro Miniature Coaxial (AMMC) PCB connector suitable for space-constrained RF applications with 50Ω impedance requirements. These connectors are fully compatible with the Hirose W.FL and IPEX MHF III series. The connectors are low profile, 1.4mm off the board, mated, with a small footprint of 2x2mm.
3-8GHz upconversion mixer offers excellent linearity
Linear Technology has announced the LTC5576, an active double balanced upconversion mixer with very wide RF frequency range, extending from 3to 8GHz. The LTC5576 enhances microwave transmitter and upconversion performance with linearity of 25dBm OIP3 and conversion loss of only 2dB at 8GHz, providing superior output signal quality compared to alternative passive mixers, which typically have 8dB of loss.
Conical inductors features full-length cap to protect coil
Highlighting their recently expanded line of BCL/BCR series conical inductors, Coilcraft will be at IMS 2015 next week in Phoenix. The products are offered in two configurations, the BCR series has a full-length cap to protect the coil and provide a large surface for pick and place and the BCL series features 'flying leads' to allow precise positioning and adjustment of the mounting angle.
6Gb/s SATA-compatible SSDs suit a multitude of applications
TDK has announced the August 2015 availability of its SDS1B series of 6Gb/s Serial ATA compatible 2.5" SSDs for industrial applications, featuring theGBDriver GS1 NAND flash memory controller chip.The SSDs are designed for use in factory automation, railway equipment, kiosk, POS, ATM, banking & till terminals, in-car navigation systems, office equipment, digital signage, medical measuring & diagnostic equipment, 4G LTE-A base station equi...
Preview for Pickering Interfaces for the International Microwave Symposium – Phoenix, AZ
Pickering Interfaces will showcase their broad catalog of Ethernet LXI and PXI RF & Microwave switching solutions at the IEEE MTT-S 2015 International Microwave Symposium (IMS) at booth #2814 on May 19 - 21, 2015.
RF analysers target spectrum monitoring applications
The NRA series of compact rack-mount RF analysers has been expanded by Narda Safety Test Solutions with the introduction of two new ‘RX’ models, which have been specifically designed for spectrum-monitoring applications. The analysers are ideal for short- and long-term observation of all types of RF signals, including pulsed and sporadic transmissions, and will attract oraganisations including communications authorities, broadcast com...
Preview of switching modules at SMT Hybrid Packaging
Pickering Interfaces will be showcasing its latest switching modules and chassis at SMT Hybrid Packaging 2015 on 5th to 7th May, 2015in booth 6-110. It's latest products include additions to Pickering’s PXI 16A switching, PXI isolated power supply and PCI fault insertion solutions.
MPMs make full use of the latest 0.25µm GaN MMIC technology
TMD Technologies will be highlighting its latest solid state and TWT based high power density MPMs on Stand 40 at Electronic Warfare (EW) Europe 2015. These latest MPMs (Microwave Power Modules), namely the solid state PTS6900 and TWT-based PTXM units underline TMD’s reputation and expertise in the EW/ECM (Electronic CounterMeasures) field, where they have supplied products for airborne, ground based and naval platforms.
PHY IP targets 16nm FinFET Plus processes for mobile SoCs
To enable designers to integrate required functionality in mobile and enterprise SoCs with less risk, Synopsys has introduced a portfolio of DesignWare PHY IP for TSMC's 16nm FinFET Plus (16FF+) processes. The silicon success of the DesignWare IP in TSMC's 16FF+GL and 16FF+LL processes enables designers to accelerate the development of SoCs that incorporate embedded memories and interface IP for USB 3.0, 2.0 and HSIC; PCIe 4.0, 3.0 and 2.0; SATA ...