Search results for "chips"

RF Micro Devices today unveiled the highly integrated RF6555 ZigBee front end module (FEM). The RF6555 is RFMD’s newest ZigBee FEM and is optimized for smart energy/advanced metering infrastructure (AMI) applications providing utilities and consumers more control over how they monitor and save energy. ZigBee is a global low power wireless networking standard for monitoring and control across a variety of applications, including energy managemen...

RF Micro Devices announced today it is teaming with Ember Corporation to introduce ZigBee front end modules (FEMs) for smart grid applications that give utilities and consumers more control over how they monitor and save energy. ZigBee is a global wireless networking standard for monitoring and control in a variety of applications such as energy management, safety and security, lighting and appliances.

RF Micro Devices announced that global smartphone and tablet manufacturers designing around the WiLink™ 6.0 and WiLink 7.0 platforms from Texas Instruments Incorporated (TI) (NYSE: TXN) can integrate RFMD’s RF3482 to gain reliable, flexible WiFi connectivity. Volume shipments of the RF3482 have begun, and RFMD estimates shipments will increase in support of key cellular and consumer device manufacturers.

Imec announces that it has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML’s NXE:3100 EUV lithography tools in the field, improving the tools’ overlay and critical dimension (CD) tool performance. With this milestone achievement, imec confirms that its CMORE business line is ready to provide its partners with custom specialty chip solutions.

TenAsys Corporation (www.tenasys.com), a leading provider of real-time OS and virtualization software, announces that all of its embedded virtualization software products, including the INtime® real-time OS for Windows®, provide full support for new 2010 Intel® Core™ processors and companion chipsets for the embedded market.

Assembléon is stressing the value of energy efficient pick & place at this year's IPC APEX Expo (Las Vegas April 12-14, Booth 508). While saving up to $10.000 in operating costs alone per pick & place machine per year, the low energy consumption of all A-Series solutions in the market today help to drastically reduce the SMT industry’s carbon footprint. The company is also using APEX to announce the extension of its compact, modular and econom...

Royal Philips Electronics subsidiary Assembléon’s recently released Twin Placement Robot (TPR) is reducing the cost of placement for memory module assembly, and will soon be doing the same for semiconductor backend manufacturing. The TPR fits on Assembléon’s A-Series pick & place equipment to give a single platform that can place up to 110,000 ICs and chip components per hour – eliminating the need for a separate line balancing machine. T...

Royal Philips Electronics subsidiary Assembléon’s recently released Twin Placement Robot (TPR) is reducing the cost of placement for memory module assembly, and will soon be doing the same for semiconductor backend manufacturing. The TPR fits on Assembléon’s A-Series pick & place equipment to give a single platform that can place up to 110,000 ICs and chip components per hour – eliminating the need for a separate line balancing machine. T...

Assembléon’s Twin Placement Robot, the latest addition to its A-Series pick & place equipment, has been received multiple innovation awards at this year’s Nepcon China in Shanghai. The Twin Placement Robot (TPR) received EM Asia’s Innovation award 2011 in the high volume assembly category. In the same category it also received the award for best exhibited technology from the SMT Association China.

The R&S TS8950G and R&S TS8980S RF test systems from Rohde & Schwarz now allow conformance and precompliance testing for VAMOS. Using VAMOS, network operators can double the channel capacity of GSM base stations.