Search results for "chips"

The IPC912-213-FL is a fanless barebone embedded system with 2 expansion slots and only measures 142 x 248 x 185 mm in size. It supports socket G2 2nd generation for Intel Core i7/ i5/ i3/ Celeron processor up to 35W. This super compact unit has front-accessible I/O design enabling easy and fast maintenance.

The new open frame panel computer has outstanding configuration flexibility of the FDK series released by Axiomtek, the FDK150-830, FDK170-830 and FDK190-830. This series is designed for immediate integration and can be widely deployed in indoor kiosk, HMI automation, and many more applications. Its slim ID can fits into any space or encased in any chassis, the FDK series comes with a front panel open frame design, available currently in 15”,...

Axiomtek announces a new most robust 15-inch IP66-rated fanless touch panel computer, the GOT-815 series. It comes with an industrial-grade design for rugged conditions, operates well under sunny/rainy conditions, in dusty/wet spaces such as food factories or kitchens and many other severe applications. Powered by Intel® Atom™ processor N270 1.6 GHz with Intel® 945GSE Express chipset, the GOT-815 delivers great computing performance at low...

XIOMTEK’s NA-820L is its new cost-effective network appliance platform with 4 front Gigabit LAN ports. Designed specifically for small and medium business, the NA-820L combines firewall, virtual private network (VPN), IDS/IPS, content filtering, UTM, network management, network security capabilities. Built with Intel 945GC+ICH7R chipset, the extreme cost-effective network appliance supports an Intel Core™2 Duo processor up to 1.8 GHz with a...

VIA Technologies demos its latest VIA EPIA-M850 Mini-ITX board, the first to feature the new VIA VX900 chipset which takes the latest HD video codecs in its stride.

The growing complexity of microelectronic systems makes it necessary to align and coordinate the development of chips, packages and boards at a very early stage, especially when it comes to system-in-package (SiP) applications.

Infineon Technologies has won the Bavarian State Award for Electric Mobility. Martin Zeil, Bavarian Minister of Economics, Infrastructure, Transport and Technology, presented the award to Peter Bauer, CEO of Infineon Technologies AG, yesterday evening. The ceremony at which the awards were conferred in altogether seven categories was held alongside the eCarTec International Trade Fair for Electric Mobility in Munich. The award went to Infineon in...

Infineon is supplying its next generation of security controllers of the SLE 78 product family for the new German ID card. The German authorities have been issuing the new electronic ID in chip card format since November 1, 2010. Infineon is providing a significant share of the chips for Europe’s biggest ID project. Currently, around 60 million German ID cards are in circulation, usually valid for ten years. About 6.5 million ID cards are issue...

To address the growing Dual-SIM (Subscriber Identity Module) market Infineon Technologies today launched its new XMM2138 platform, supporting Dual-SIM operation. Dual-SIM mobile phones enable simultaneous use of two SIMs in the handset, with features like call hold and swap to provide real-time switching facility between both SIMs at the touch of a button. Today there is a high growth rate for Dual-SIM phones in the BRIC (Brazil, Russia, India, a...

AAEON released a new 1U Intel Xeon 3400 Series Network Appliance with 10 LAN Ports: FWS-7800. This 1U compact chassis, highlighted by a terrific thermal solution, is another complete system solution in the networking appliance product line.