Search results for "thermal"
Pressure sensor fits PCBA footprint for barometric applications
Available now from distributor DigiKey is Amphenol Advanced Sensors’ NPB 102 absolute pressure sensor with digital output for low power consumption and applications with a wide operating temperature range.
New ams OSRAM OSTAR LEDs
ams OSRAM has added four new LEDs to its family of OSTAR Projection Power products designed with projectors in mind.
Infineon's OptiMOS power MOSFETs new at Rutronik
Infineon’s OptiMOS power MOSFETs with 25V to 150V are now available at Rutronik as an improved version in the source-down package with bottom-side cooling and centre-gate footprint.
productronica: printed circuit boards love ELPEPCB HSP 801
At productronica, Peters presents the printable ELPEPCB heatsink paste HSP 801 which features an increased thermal conductivity.
Optimised lenses for satellite developers
Resolve Optics is a European designer and supplier of application optimised lenses for satellite developers seeking to operate optical instruments in Low Earth Orbit (LEO).
Molex announces KickStart Connector System
Molex has expanded its array of solutions recommended by the Open Compute Project (OCP) with the introduction of the KickStart Connector System.
MicroCare introduces Tergo cleaning fluids to precision cleaning fluid line
MicroCare LLC announces the expansion of its precision cleaning fluid line with the introduction of new Tergo vapour degreasing cleaning fluids.
Cambridge GaN Devices at PCIM 2024
Cambridge GaN Devices (CGD) will take the opportunity afforded by PCIM (Nuremberg Messe, 11-13th June) to demonstrate how the company’s product portfolio is developing to address higher power applications such as motor drives, inverters and data centres, as well as lower power, ultra-compact smart portable device adapters and chargers.
ESA’s Proba-3 mission enters the last test phase prior to launch
Proba-3 will achieve, for the first time, a high-precision formation flight between two platforms in space, demonstrating the feasibility of technologies that will allow large telescopes sharing distant elements to be developed.
TE Connectivity empowering AI evolution
TE Connectivity will showcase a broad range of high-speed data communications connectivity solutions in booth B26 at the OCP Global Summit Oct 17-19, 2023 at the San Jose Convention Centre.