Search results for "EDA"

LFoundry today announced the availability of a high performance process design kit (PDK) for A/MS electronic designs, developed using Tanner EDA’s HiPer Silicon software, for its LF150 modular 0.15 µm Low Power and RF CMOS process. This grants Tanner EDA customers access to Europe’s leading pure-play foundry CMOS technology.

Multi-project wafer services company MOSIS has teamed up with IBM¹s silicon foundry to offer 90nm chip process technology on a shared-wafer basis. The MPW service will give many companies that have previously found sub-micron silicon fabrication costs prohibitive access to these technologies for as little as 10% of the price of a dedicated wafer run.

MOSIS has partnered with Cambridge Consultants to offer customers royalty-free access to the XAP4 and XAP5 16-bit RISC processor cores - and - customers only have to pay 20% of the nominal license fee during prototype production, the balance of the fee not being due until devices go into volume production or are sold.

MOSIS, a provider of low-cost prototyping and small volume production services for custom ASICs, announces prototype and low volume fabrication access to IBM's fourth generation foundry technology, 8WL, the 130 nanometer (nm) silicon germanium (SiGe) bipolar complementary metal oxide semiconductor (BiCMOS) process. The process uses an emitter width of just 120nm and can be used to produce devices with an Ft of 100GHz. It creates low power devices...

MOSIS, a provider of low-cost prototyping and small volume production services for custom ASICs, announces availability of the IBM 0.25 micron SiGe BiCMOS 6WL technology. Utilising the service gives ASIC designers access to this advanced technology at less than 10% of the cost of a dedicated wafer run, minimizsing up-front risk and costs. The process is suited to high-performance analogue chip design for consumer wireless applications including ...

EDA Solutions, sole representative in Europe for Tanner EDA, announced it has been appointed as the sole representative in Europe for Incentia Design Systems Inc. Incentia’s complete suite of industry-leading tools will be available in Europe via EDA Solutions, including: TimeCraft™, a static timing and signal integrity analyser, known for its fast runtime and capability to handle large designs; DesignCraft™, a complete logic synthesis tool...

EDA Solutions has appointed Steve Attfield as Sales Manager for Northern Europe, covering the UK, Benelux and the Nordic countries. Attfield has more than 20 years experience in sales and product marketing roles in the electronics industry, primarily in semiconductors and EDA tools.

Tensilica has introduced the Xtensa LX3 high-performance dataplane processor (DPU) core optimized for digital signal processing (DSP) and control in the system-on-chip (SOC) dataplane. The Xtensa LX3 DPU offers the industry's widest range of pre-verified DSP options ranging from a simple floating point accelerator to a 16-MAC (multiply accumulator) vector DSP powerhouse.

Tensilica has announced that it has expanded the range of processor modeling options with the introduction of pin-level SystemC models of its Xtensa customizable dataplane processors (DPUs). With this novel feature, Tensilica now offers the widest array of modeling choices of any provider of licensable microprocessor or DSP (digital signal processing) IP cores.

Zuken annonce des améliorations d'intégration entre sa solution Board Designer et le logiciel Advanced Design System (ADS) d'Agilent Technologies.