Search results for "chips"
VIA EPIA-M850 Mini-ITX Board Does HD Video
VIA Technologies demos its latest VIA EPIA-M850 Mini-ITX board, the first to feature the new VIA VX900 chipset which takes the latest HD video codecs in its stride.
German Research Project CoSiP Lays Foundation for Simultaneous Development of Chip, Package and PCB Board for System-in-Package Applications
The growing complexity of microelectronic systems makes it necessary to align and coordinate the development of chips, packages and boards at a very early stage, especially when it comes to system-in-package (SiP) applications.
Infineon Wins Bavarian State Award for Electric Mobility
Infineon Technologies has won the Bavarian State Award for Electric Mobility. Martin Zeil, Bavarian Minister of Economics, Infrastructure, Transport and Technology, presented the award to Peter Bauer, CEO of Infineon Technologies AG, yesterday evening. The ceremony at which the awards were conferred in altogether seven categories was held alongside the eCarTec International Trade Fair for Electric Mobility in Munich. The award went to Infineon in...
Infineon to Supply Next Generation of Security Controllers for German ID Cards, Europe’s Biggest ID Project
Infineon is supplying its next generation of security controllers of the SLE 78 product family for the new German ID card. The German authorities have been issuing the new electronic ID in chip card format since November 1, 2010. Infineon is providing a significant share of the chips for Europe’s biggest ID project. Currently, around 60 million German ID cards are in circulation, usually valid for ten years. About 6.5 million ID cards are issue...
New XMM2138 Platform from Infineon Supports Growing Dual-SIM Market
To address the growing Dual-SIM (Subscriber Identity Module) market Infineon Technologies today launched its new XMM2138 platform, supporting Dual-SIM operation. Dual-SIM mobile phones enable simultaneous use of two SIMs in the handset, with features like call hold and swap to provide real-time switching facility between both SIMs at the touch of a button. Today there is a high growth rate for Dual-SIM phones in the BRIC (Brazil, Russia, India, a...
AAEON - FWS-7800 Hot Swappable Appliance
AAEON released a new 1U Intel Xeon 3400 Series Network Appliance with 10 LAN Ports: FWS-7800. This 1U compact chassis, highlighted by a terrific thermal solution, is another complete system solution in the networking appliance product line.
AAEON Releases An Eco-Friendly Embedded Controller – GES-3300F
AAEON has unveiled an eco-friendly solution that belongs to AAEON’s Green Embedded Systems product line, called GES-3300F. The difference between the first Green Embedded Controller (GES-1100F) and the new Green Embedded Controller (GES-3300F) is simply the processor.
AAEON Unveils 3.5 SubCompact Board--GENE-9315
AAEON, a premier Industrial PC manufacturer, announced a new 3.5” SubCompact Board—GENE-9315. To fulfill the increasing demands of I/O expansions, the GENE-9315 has added more user-friendly features and functions to the AAEON Intel® AtomTM product line.
AAEON Unveils the Intel Atom Processor D510-based COM Express CPU Module: COM-LN
AAEON, a premier Industrial PC manufacturer, announces a brand new COM Express CPU module that adopts the Intel® AtomTM processor D510, the first dual-core chip in the Intel Atom processor family supported for embedded applications. With the increasing demand for smaller, lower-power, yet higher-performance embedded solutions, the COM-LN brings the state-of-the-art technology of the Intel® AtomTM processor to the embedded world.
AAEON Unveils New EPIC Board: EPIC-QM57
AAEON launched a new, high performance EPIC Single Board Computer: EPIC-QM57. The EPIC board is sized at 115mm x 165mm which falls between the 3.5” SubCompact Board and a Mini-ITX Motherboard. This EPIC board offers the flexible expansion ability of the Mini-ITX form factor with the compact size near that of the 3.5 SubCompact Boards, thus making it attractive for Embedded System developers.