Search results for "thermal"

Designed for medical device manufacturing, MasterSil 711Med passes ISO 10993-5 testing.

The Chomerics Division of Parker Hannifin Corporation is unveiling a new thermal interface gel that is ideal for all manufacturers faced with meeting the challenges of high-throughput production.

Indium Corporation will showcase its advanced assembly materials for PCBA and powerelectronics, including those for the rapidly evolving electric vehicle manufacturing and e-Mobility market, at Productronica, November 14-17, in Munich, Germany.

Eatron Technologies assists vehicle manufacturers in mitigating the potential of EV battery fires through the application of artificial intelligence in its battery management software.

TRACO POWER has released its new TCI 500U series of power supplies rated up to 450W @ 230 VAC and 400W @ 115VAC conduction-cooled operation and 500W with 30CFM airflow.

Vishay has announced the release of a new series of wet tantalum capacitors with hermetic glass-to-metal seals.

Optical Surfaces has announced its large diameter aspheric lenses, used as critical focusing optics in high-power laser research.

Drones have gained immense popularity across various industries, ranging from agriculture and surveillance to delivery. A powerful and efficient processing solution is essential to meet the increasing demand for advanced drone capabilities. Explore the integration of e-con Systems' multi-camera solution with the Qualcomm RB5 kit, providing exceptional features such as multi-camera support, power efficiency, high computational performance, and the...

Multi-camera applications have become increasingly popular across various industries. From surveillance systems to autonomous vehicles and robotics, the demand for processors capable of handling multiple camera inputs has grown significantly.

Siemens Digital Industries Software announces Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D and 3D technologies and substrates in the world.