Search results for "chips"

At the upcoming Electronics & Automation exhibition, taking place from May 25-27 in Utrecht, Netherlands, Essemtec will highlight the Paraquda SMD pick-and-place, the first system using ePlace operation software. Also highlighted will be the new Cobra feeder.

Combining an automatic SMD pick-and-place for series production with a semiautomatic placer for prototyping proves beneficial. A universal data interface developed by Essemtec ensures an easy, secure transition from prototyping into production and avoids confusion about data versions.By Adrian Schärli, Azular GmbH, for Essemtec AG

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today announced the release the S511 Solid State Drive (SSD), which employs the latest SATA 6Gb/s specification. With this cutting edge implementation of the latest data transfer standard, the performance of this SSD has been dramatically raised over conventional SATA II products.

An in-depth look inside an Intel FAB (Fabrication Facility) - Technicians in a clean room where 300mm silicon wafers are etched with the circuit patterns of hundreds of computer chips (microprocessors) - each chip has multiple-cores, or brains.

Inphi Corporation (NYSE: IPHI), a leading provider of high-speed analog semiconductor solutions for the communications and computing markets, today announced that its Isolation Memory Buffer (iMB) 02-GS02A has completed a significant milestone for the component validation phase with Intel. Memory vendors will now be able to use Inphi’s iMB components to build memory modules for DIMM level qualification.

AMD is deploying the next chapter in Retail 2.0 evolution with the introduction of the VISION Experience Center (VEC) by AMD during a simulcast and do–it-yourself computer system build. The simulcast will be hosted by Tony Fernandez-Stoll, director of Regional Marketing, AMD and George Ali, vice president of Merchandising, Components & DIY, TigerDirect

AMD (NYSE: AMD) today announced that it amended its Wafer Supply Agreement (WSA) with GLOBALFOUNDRIES Inc. The primary purpose of the amendment was to revise the pricing methodology applicable to wafers delivered in 2011 for AMD’s microprocessor and accelerated processing unit (APU) products. The amendment also modified AMD’s existing commitments regarding future increases in production of certain graphics processing unit (GPU) and chipset ...

HCD, the contract electronics manufacturer, PCB design house, cable assembler and box build specialist, has made a significant contribution to film processing company, FilmLight winning four Science and Technology Awards from The Academy of Motion Picture Arts and Sciences – commonly referred to as ‘Tech Oscars’ – providing PCB layout and assembly services to the Soho-based company.

4D Systems launched today two new display modules: uLCD-144(SGC) and uLCD-144(GFX). The new modules include a 1.44”, full colour active matrix LCD TFT display and are based on 4D Labs’ GOLDELOX-SGC and GOLDELOX-GFX2 chips. Their rich set of features, tiny form factor, low cost, and ease-of-use make them one of the most flexible graphics solutions available.

Broadcom has today released the BCM3472, the industry's first fully integrated 40nm Dual ISDB-T receiver chipset. Addressing the growing popularity of digital TV in Latin America, Broadcom is driving the deployment of digital terrestrial TV services in Brazil and a range of emerging markets around the world.