Search results for "chips"

The OpenET Alliance has today announced its first wave of members, and the release of an updated interface specification for cellular terminals. The Alliance membership includes Altair Semiconductor, Anadigics, Huawei, Maxim, Nujira, Sony and the University of Florence.

Hittite Microwave Corporation announces the release of the highly integrated HMC6000 and HMC6001 silicon transceiver chipset which targets 60 GHz applications such as: metrocell/picocell backhaul, WiGig (IEEE 802.11ad) multi-Gbps solutions including wireless cable replacement (HDMI, USB 3.0, DisplayPort), wireless docking stations, video/magazine kiosks and wireless sensors.

Extending its always-on, connected lifestyle vision to next-generation networks, Marvell today announced an end-to-end, enhanced LTE-PON platform designed to facilitate fast and efficient end-user access to home and public cloud content.

Agilent Technologies Inc. today announced its Bluetooth low-energy test solution on the N4010A wireless connectivity test set was verified by Texas Instruments Inc. for use with TI's integrated circuits in Bluetooth Smart and Smart-Ready devices.

Mindspeed Technologies, Inc. has today announced that it has integrated support for smart Distributed Antenna Systems technology into its industry leading range of System-on-Chip for small cell products. With this capability, Mindspeed can support ‘hybrid’ systems, with small cell base stations feeding DAS equipment, extending the opportunities for small cells and bringing new value to companies currently developing DAS products.

Broadcom Corporation today announced that its family of 5G WiFi chips (based on the IEEE 802.11ac standard) won a prestigious R&D 100 Award. Selected by an independent judging panel and the editors of R&D Magazine, the R&D 100 Awards represent the 100 most technologically significant products of the past year.

Broadcom Corporation today announced the Wi-Fi Alliance selected Broadcom for its Wi-Fi CERTIFIED Passpoint Test Bed. Broadcom's BCM43224, BCM4718 and BCM4322 are among the first chips to obtain the Wi-Fi CERTIFIED Passpoint designation and will be used as a benchmark for testing and validating future products.

INSIDE Secure have declared the appointment of Pierre Garnier as executive vice president of the NFC and secure payment division and member of the management board, effective as of August 1, 2012. Mr. Garnier replaces Charles Walton who will be leaving the company later in August to become chief executive officer of Canadian company SecureKey, a partner of INSIDE Secure in the NFC and secure transactions industry.

The benefits to the transformation to next generation networks for operators are obvious. However, this challenging transition will not happen overnight, it will require operators to continue to leverage their legacy network infrastructure. At present, operators are trying to bridge the gap between validating their all IP-network solutions for conformance, performance and interoperability and in some cases still maintaining a first-class service ...

DAN3300 single-SoC Platform for low-cost Picocell Access Points - As DesignArt Networks introduces its ground-breaking 40nm DAN3000 SoC family with the launch of five distinct SoC chips, the company today announced its third base station SoC platform – the DAN3300.