Search results for "chips"

M/A-COM Technology Solutions introduced today two new Front End Integrated Circuits (FEICs). The XZ1003-QT and XZ1004-QT are fully integrated, monolithic, FEICs for Multi Media over Coax Alliance (MoCA) mid-band and high-band RF applications. Both devices are fully compatible with Entropic Communications c.Link MoCA RF transceivers.

TE Circuit Protection announces a family of eight new single- and multi-channel silicon ESD (SESD) protection devices offering the lowest capacitance (bi-directional: 0.10pF typical; uni-directional: 0.20pF typical), highest ESD protection (20kV air and contact discharge) and smallest size (multi-channel: smallest flow-through form-factor and 0.31mm height) packages available on the market.

Acculogic Inc will highlight its leading test technologies in Booth #3321 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

DFI introduces a new industrial uATX form factor motherboard utilizing the Intel G41 Express chipset with Intel ICH7 I/O controller hub. This new embedded board supports 45nm Intel Core2 Quad and Intel Core2 Duo processors with 800/1066/1333 MHz Front Side Bus (FSB), delivering high-performance computing in multi-core enabled application environments.

DFI today announces 2 new embedded boards in its product line based on the new Intel Q77 Express chipset. The 2 microATX form factor boards support the 3rd generation Intel Core processor family which is the next generation of 64-bit, multi-core processor built on 22-nanometer process technology.

DFI launched the Mini-ITX form factor SB330-CRM scalable desktop platform offering higher processing performance, superior graphics display support, and evolutionary memory system and I/O interface improvements. This embedded board uses an Intel® Q67 chipset supporting the quad core Intel® Core™ i7-2600 and i5-2400 processors, and dual core Intel® Core™ i3-2120 processor utilizing 32-nanometer process technology. The graphics and processor...

DFI today launches the Mini-ITX form factor HR100-CRM mobile platform offering higher processing performance, superior graphics display support, and evolutionary memory system and I/O interface improvements. This embedded board uses an Intel® QM67 Express chipset supporting the quad core 2nd Generation Intel® Core i7-2710QE processor and dual core 2nd Generation Intel® Core™ i5-2510E processor on 32nm process technology.

CAN2GO, a leading provider of wired and wireless controllers for building automation is enabling companies to cut up to 40 percent off their building automation installation labor costs, with the help of ZigBeeâ wireless networking technology from Ember.

Cavium Networks (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for networking, communications, and the digital home, announced today it has delivered its flagship 32-core OCTEON II CN6880 processor to multiple Tier 1 customers building a wide range of wireless and wired infrastructure networking applications.

Synchronized with the market launch of the new XMC4000 microcontroller (MCU) family of Infineon Technologies which is based on ARM Cortex-M4 processor, PLS Programmierbare Logik & Systeme presents its Universal Debug Engine (UDE) 3.2.1, optimized test and debug tools for the high performance and also energy efficient SoC devices.