Search results for "SEMI"
u-blox incorporates Nordic’s Bluetooth chips in new modules
u-blox has announced two additions to its Bluetooth LE portfolio, ALMA-B1 and NORA-B2, which are utilising Nordic Bluetooth chips.
Data centre chip industry to surpass a CAGR of 8.1%
According to DataHorizzon Research, the data centre chip market was valued at $11.1 Billion in 2022. It is anticipated to witness substantial growth, reaching a market size of $23.8 Billion by 2032, with a Compound Annual Growth Rate (CAGR) of 8.1%.
Empower Semiconductor signs European distributor agreement with Dimac Red
Empower Semiconductor unveiled a new partnership agreement with Dimac Red Spa, a sales and engineering firm dedicated to providing the European market with high-reliability electronic products, alongside design and engineering services.
GigaDevice to showcase at embedded world 2024
GigaDevice will showcase its comprehensive product lineup at the embedded world 2024 event held in Nuremberg, Germany from April 9th to 11th.
Mouser ships NXP MCX MCUs
In stock at distributor Mouser Electronics are the MCX industrial and IoT microcontrollers (MCUs) from NXP Semiconductors.
Taiwan’s biggest earthquake threatens global tech supply chain
Taiwan's biggest earthquake in 25 years has impacted operations at local semiconductor firms, raising concerns about disruptions to the global technology supply chain.
Heraeus Electronics hosts ALL2GaN event
Heraeus Electronics is proud to announce that it will host an upcoming ALL2GaN event from April 9-10, 2024, at its facilities in Hanau.
Nexeon breaks ground on first silicon anode material production site
Nexeon marked a significant advancement with the commencement of construction on its inaugural commercial production plant.
AA Manufacturing signs distribution deal Diotec
AA Manufacturing has signed a semiconductor franchise distribution deal with discretes producer, Diotec.
Indium Corporation’s Sze Pei Lim at ICEP Japan
Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP Japan 2024).