Search results for "SEMI"
Alphawave Semi at OFC 2025
Alphawave Semi is pleased to participate in this year's Optical Fiber Communications Conference & Exhibition (OFC).
Alphawave Semi reveals suite of optoelectronics silicon products
Alphawave Semihas revealed its portfolio of optoelectronics products addressing the high-speed interconnect semiconductor market, which is forecast to exceed $4 billion by 2028.
Alphawave Semi to showcase innovations
Alphawave Semi will demonstrate its High Speed Communication IP atDesignCon 2025.
Alphawave Semi at Chiplet Summit 2025
Alphawave Semi has announced its participation at the Chiplet Summit Conference and Exhibition.
SEMI to develop cybersecurity strategy and roadmap
SEMI has announced the creation of a strategic roadmap for cybersecurity implementation throughout the semiconductor industry.
SEMI announces the MEMS & Sensors Executive Congress 2024
Industry visionaries and experts will gather October 7-9 at the MEMS & Sensors Executive Congress (MSEC 2024) at the Château-Bromont Hotel in Bromont, Quebec, Canada for insights into the latest trends and innovations in sensorisation.
SEMI Energy Collaborative: recommendations to boost low carbon energy in South Korea
In an effort to help the global semiconductor value chain lower greenhouse gas (GHG) emissions,the industry association SEMIreleased its first region-specific analysis of current and forecasted low-carbon energy (LCE) markets for South Korea.
SEMI and Policy Equity Group fund initiative for semiconductor child care gaps
Seeking to bolster the semiconductor industry workforce in the US by addressing gaps in child care needs, the SEMI Foundation and Policy Equity Group have announced a collaboration to help companies comply withchild care requirementsunder the US CHIPS and Science Act.
Alphawave Semi launches 3nm UCIe IP with TSMC CoWoS packaging
Alphawave Semi has launched the industry's first 3nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology.
SEMICON Japan 2024 to open doors
SEMICON Japan is to open its doors to the public on 11th December at Tokyo Big Sight.