Search results for "microelectronics"
imec and Dow Corning Advance Enabling Technologies for 3D IC Semiconductor Packaging
Dow Corning is the latest organization to join imec, a leading research centre for the advancement of nano-electronics. The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit packaging technologies, wherein IC chips are stacked in vertical 3D architectures.
eMemory and UMC Expand Non-volatile Memory Cooperation to Advanced 28nm Process
eMemory and United Microelectronics Corporation today announced an expanded technology cooperation to integrate eMemory's one-time-programmable and multiple-time-programmable embedded non-volatile memory technologies into UMC's 28nm process.
Synopsys and UMC Collaborate to Accelerate Development of UMC's 14-nm FinFET Process
Synopsys and United Microelectronics Corporation today announced that the collaboration between the two companies has resulted in the successful tapeout of UMC's first process qualification vehicle in its 14-nanometer (nm) FinFET process utilizing Synopsys' DesignWare Logic Library IP portfolio and StarRC parasitic extraction solution, a part of the Galaxy Implementation Platform.
Synopsys Collaborates with A*STAR IME to Optimize TSI Technology
Synopsys announced that it will join Singapore's A*STAR Institute of Microelectronics -led 2.5D TSI Consortium to provide the framework for heterogeneous 3D-IC systems using through-silicon interposer technology. Synopsys will contribute its market expertise to the consortium to optimize TSI technology for cost-effective and performance-driven applications. The consortium's research and development efforts will lead to the demonstration of a hete...
Rogue Valley Microdevices Hosts iGrant Competition for MEMS and Microsystem Technologies
Rogue Valley Microdevices are hosting the iGrant Competition for MEMS and microsystem technologies. Designed to help researchers with brilliant ideas see those ideas through to a finished product, the 2013Sustainable Valley iGrant is a technology innovation grant to help researchers, entrepreneurs and engineers bring new technology or technology-based businesses to life.
Northrop Grumman Develops New Gallium Arsenide E-Band High-Power MMICs
Northrop Grumman has developed new gallium arsenide Monolithic Microwave Integrated Circuit high-power amplifiers operating in the E-Band communication frequency spectrum. The APH667 and the APH668 are GaAs-based broadband, three-stage amplifier devices that operate from 81 – 86GHz and 71 – 76GHz respectively.
European Project Drives The Future Of Power Microelectronics
LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements that place Europe at the forefront of research and the commercialization of energy-efficient devices for industrial and automotive applications, consumer electronics, renewable-energy conversion systems, and telecommunications.
European Project Drives the Future of Power Microelectronics
LAST POWER 1, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements that place Europe at the forefront of research and the commercialization of energy-efficient devices for industrial and automotive applications, consumer electronics, renewable-energy conversion systems, and telecommunications.
Lime Micro Announces Deal With Europraxis
Lime Micro has just announced a deal with Europraxis that will see its open source Myriad RF platform and its field programmable transceiver put in front of all EU universities. The company is hoping this will vastly increase both RF skills in graduates and the number of people innovating wireless systems.
“Places2Be” project to boost European leadership around FD-SOI – the faster, cooler, simpler chip technology
The launch of Places2Be, a 3-year, €360M advanced-technology pilot-line project to support the industrialization of Fully-Depleted Silicon-On-Insulator microelectronics technology was announced today by a group of 19 leading European companies and academic institutions.