Search results for "microelectronics"
Hands-free mobile and video calls with exceptional speaker quality
Wolfson Microelectronics introduce the latest software solutions in its Ez2 software feature collection, Ez2 grouptalk and Ez2 facetalk. These are designed to work alongside Wolfson’s existing hardware platforms, such as the WM5110 High Definition Audio Hub, to dramatically improve the speaker quality for hands-free mobile, VoIP and video calling on smartphones, tablets, personal computers and televisions, as well as the growing market for mobi...
Achieve cinema-quality sound on the move with Wolfson's Ez2 software
Wolfson Microelectronics announce the latest software solution from its Ez2 software feature collection, Ez2 listen, which works alongside Wolfson’s existing hardware platforms, such as its High Definition Audio Hubs, to deliver rich, cinema-quality sound to mobile applications such as smartphones and tablets.
UMC and SuVolta join together to develop 28nm Low-Power Process Technology
United Microelectronics and SuVolta reveal their joint technology development of a 28nm process that integrates SuVolta's Deeply Depleted ChannelTM transistor technology into UMC's 28nm High-K Metal Gate high-performance mobile process. SuVolta and UMC are working together to take advantage of implementing DDC transistor technology to reduce leakage power and improve SRAM low-voltage performance.
Sharp’s latest smartphones and tablets utilise Wolfson HD Audio Hub
Wolfson Microelectronics has today revealed that Sharp has adopted Wolfson’s WM5102 High Definition Audio Hub for its new range of AQUOS smartphone and tablet devices. The WM5102 enables exceptional audio quality in the AQUOS PHONE ZETA SH-06E and AQUOS PHONE si SH-07E, as well as the upcoming AQUOS PAD SH-08E tablet, all from NTT DOCOMO.
INSYS announce firmware update 2.11
INSYS expands the functional range of its industrial routers through new security features included in the firmware update 2.11. Thereby, INSYS icom is one of the first providers to follow the current recommendations of the German Federal Office for Information Security and the white paper of the German Association of Energy and Water Industries
Samsung announce industry’s fastest embedded memory
Samsung has announced today that it is mass producing the world's fastest embedded memory – the industry's first eMMC 5.0 devices – in 16GB, 32GB and 64GB densities for next-generation smartphones and tablets. Featuring an interface speed of 400MB/s, the lightning-fast eMMC PRO memory provides exceptionally fast application booting and loading.
NEPCON will see VJ Electronix showcase its Vertex II X-ray Inspection System
VJ Electronix will showcase its new Vertex II next-generation X-ray technology and the high-performance SRT Micra rework platform in the Kasion Booth 1H43 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China. VJ Electronix will present the new Vertex II 130. The Vertex II, recent winner of the NPI Award, incorporates the latest advances in X-ray imaging components with ...
STMicroelectronics publishes 2012 sustainability report
STMicroelectronics announce the publication of the Company’s 2012 Sustainability Report. ST’s sixteenth annual Sustainability report contains comprehensive details of ST’s Sustainability strategy, policies and performance during 2012 and illustrates how the Company’s new Sustainability Strategy, covering its People, Products, the Environment and the Community, became increasingly embedded throughout the business to create value for all of...
Cadence Physical and Electrical DMF Signoff adopted by UMC
Cadence Design Systems reveal that after extensive benchmark testing, semiconductor foundry United Microelectronics Corporation has adopted the Cadence “in-design” and signoff design-for-manufacturing flows to perform physical signoff and electrical variability optimization for 28nm designs. The flows address both random and systematic yield issues, providing customers with another proven foundry flow for 28nm designs.
UMC joins IBM chip alliance for 10nm process development
IBM and United Microelectronics Corporation is pleased to announce today that UMC will join the IBM Technology Development Alliances as a participant in the group's development of 10nm CMOS process technology.