Search results for "soldering"

Soldering using formic acid vapour in combination with nitrogen (HCOOH + N2) offers significant advantages in assembly and connection technology for applications in optoelectronics and photonics. Especially in the field of sub-micron bonding, Tresky has introduced several products in recent months and is now presenting the formic acid module for reliable use in bonding processes at productronica 2023.

ASSCON Systemtechnik-Elektronik is set to showcase three new vapor phase soldering systems at this year’s productronica in Munich.

SHENMAO is pleased to announce the launch of its latest innovation, the rosin-free no-clean liquid flux SM-ZR10, specifically designed for automatic wavesolderingprocesses.

Solderstar is exhibiting at the SMTA International 2024 conference in Rosemont, Illinois, booth 2838, from October 22-24.

Littelfuse, an industrial technology manufacturing company empowering a sustainable, connected, and safer world, has announced a productupdate on the C&K SwitchesKSC2 Sealed Tactile Switch product line.

Nordson Electronics Solutions has announced that its Nordson B.V. division, which covers Europe, the Middle East, and Africa, has consolidated its offices into one site in Valkenswaard, The Netherlands, in early July.

ASMPT has presented its die and module bonding platform that can be used in a variety of ways for producing power modules.

Vishay Intertechnology has broadened its optoelectronics portfolio with the introduction of a new 890 nm high-speed IR emitting diode in a clear, untinted leaded plastic package.

The ST12 Push-Push microSD card connector from JAE is a new addition to theRutronik portfolio.

TDK has expanded its acclaimed Micronas 3D HAL-position sensor family with the introduction of the HAL/HAR 3936.