Search results for "chips"
ALSI LASER1205: patented precision for SiC wafers
ASMPT, the global provider of hardware and software for semiconductor and electronics production, presents the ALSI LASER1205, a multi-beam laser dicing platform that sets new standards in terms of precision and performance.
Infineon & Oxford Ionics to build a mobile quantum computer
Infineon Technologies, in collaboration with its technology partner Oxford Ionics Ltd., has been selected as part of a consortium to develop a mobilequantum computer.
Dukosi’s cell monitoring chipset is ready for volume production
Dukosi, the technology company revolutionising the performance, safety, and sustainability of battery systems, has announced the Dukosi Cell Monitoring System (DKCMS) for safety critical, next generation battery systems is ready for production.
Battery cell monitor moves into production
The Dukosi Cell Monitoring System (DKCMS) for safety critical, next generation battery systems is ready for production.
Why sustainable helium use is needed to future-proof the semiconductor industry
Semiconductor manufacturing processes require many chemicals and specialty gases.
Infineon pioneers world’s first 300mm power GaN wafer technology
Infineon has announced that the company has succeeded in developing the world’s first 300mm power GaN wafer technology.
Memfault joins STMicroelectronics Partner Programme
Memfault,provider of the embedded device observability and over-the-air (OTA) platform, has announced that it has joined the ST Partner Programme, allowingSTMicroelectronics’ customers that develop embedded IoT devices to gain visibility into device performance and reliability, proactively identify issues, and quickly push targeted fixes out to devices.
Sondrel announces advanced modelling process for AI chip designs
Sondrel has announced an Advanced Modelling Process for AI chip designs. This runs through every stage of a chip’s design to ‘prove’ that the design is what was specified – Functional Verification -- and that it does what it is supposed do – Performance Verification.
Tomorrow's E/E architectures require new semiconductors
What will the E/E (electrical/electronic) architecture in thevehicle of tomorrowlook like? And what requirements will this place on thesemiconductorsused?
ROHM and UAES sign a long-term supply agreement for SiC power devices
ROHM and United Automotive Electronic Systems (UAES) have recently entered into a long-term supply agreement for SiC power devices.