Search results for "Fraunhofer"
LOPEC 2024: printed electronics serving patients
LOPEC will be held in Munich from 5 - 7 March 2024. Under the focus topic of Smart Living, companies and researchers will show how printed electronics is making the health sector fit for the future.
Are ultrasonic sensors the better alternative to electrodes in prosthetics?
In the field of biomedical engineering, particularly in prosthetics, a shift from traditional electrode-based systems to more advanced technologies like ultrasonic sensors is gaining traction.
EPI achieves milestone with EPAC1.5 chip activation
The European Processor Initiative (EPI), a collaboration involving 30 partners from 10 European countries, aims to secure Europe’s autonomy in HPC chip technologies and infrastructure.
IBM unveils quantum computing centre in Germany
IBM has opened its first quantum computing center outside the US at Ehningen in Germany. It marks a significant expansion of the company’s fleet of advanced, utility-scale quantum systems available to global users via the cloud.
Photonics-based ultra-stable tuneable THz system for 6G
6G state of the art research was demonstrated at European Microwave Week in Paris by Rohde & Schwarz with a proof-of-concept for a system for 6G wireless data transmission based on a photonic THz communications link.
Fraunhofer IPMS present latest photonic tech at SPIE Photonics West
Fraunhofer Institute for Photonic Microsystems IPMS believe digitalisation, automation and efficiency are the buzzwords of the industry of the future. To this end, the Fraunhofer Institute for Photonic Microsystems IPMS develops customer-specific sensors, actuators and optical components. These represent the key technologies for IoT and numerous future applications with artificial intelligence, it claims.
Project ‘KuSIn’: driving e-mobility with copper sinter innovations
Heraeus Electronics, an expert in materials and matched material solutions for the electronics packaging, is one of five partners in the three-year joint project‘KuSIn - Copper sinter processes using induction heating for electromobility application,’funded by the German Federal Ministry of Economic Affairs and Climate Action (BMWK).
LOPEC 2023: Printed electronics - thin, brilliant, stretchable
Quantum materials for electroluminescent QD-LED displays, fast inline monitoring for thin film printing or stretchable printed electrodes. Scientists from the Fraunhofer Institute for Applied Polymer Research IAP in the Potsdam Science Park demonstrate what is already technologically possible in the field of printed electronics and present current projects at LOPEC 2023 in Munich from March 1st to 2nd (ICM, booth FO.16).
New test rig, a major milestone for fuel cell technology
Parker Hannifin’s Filtration business has reached a major milestone on the journey towards mass production of hollow fibre membrane technology for fuel cell humidification applications, a vital step towards reducing carbon emissions.
Secure optical data communication using quantum cryptography and Li-Fi
Modern quantum technology opens up many new areas of application. But it also harbours risks. Due to their enormous computing power, quantum computers could undermine even the most modern data encryption methods.