Search results for "miniaturisation"

An economical solution for power transmission in harsh environments has been developed by Belden -Lumberg Automation M12 Power Connectors. PROFINET International (PI) has decided that the L-coded variant, which is internationally standardised through the standard 61076-2-111, will be the future single standard for 24-volt PROFINET devices with round connectors.

TT Electronics launched two new ranges of SMD thick film chip resistors designed to optimise performance under pulse and surge conditions. With a value range of 1R0 to 1M0, the resistors provide surge protection in compact circuits where a small footprint size is critical to the design.TT Electronics’ PWC0603 and DSC0603 series are designed specifically to provide reliable operation under pulsed load conditions.

A research team led by UCLA electrical engineers has developed an artificial composite material to control of higher-frequency electromagnetic waves, such as those in the terahertz and far-infrared frequencies.

A series of compact LED emitters measuring just a fraction of a millimetre across is being launched at the Electronic Design Show next week by OMC.

It has been announced that Fujitsu Laboratories has collaborated with the University of Toronto to develop a computing architecture to tackle a range of real-world issues by solving combinatorial optimisation problems, which involve finding the best combination of elements out of an enormous set of element combinations.

The launch of a range of new product lines has been announced by DuPont Performance Materials (DPM) for the automotive, wire and cable, and electric and electronics markets which will be shown at the 2016 K Trade Fair.

A miniature board-to-Flexible Printed Circuit (FPC) connector has been developed by Hirose which is designed for battery pack connections in mobile devices. With a space-saving design that includes a 0.35mm pitch, stacking height of only 0.6mm, and depth of 1.5mm, the low-profile BM29 Series is the smallest hybrid board-to-FPC connector on the market.

Third-generation SiC MOSFETs, the SCT3080KL 1200V models halve on-resistance as well as reduce input capacitance, without sacrificing form factor.

NEO Tech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets, announced that its highly miniaturised electronic manufacturing capabilities are being deployed in advanced implantable devices and electroceuticals for the medial industry.Advanced implantable devices such as neuro stimulation devices, drug pumps, cochlear implants, sensors and wireless communic...

The industry’s first 800V surface-mount Silicon Controlled Rectifiers (SCR, or thyristor) specified for operation at temperatures up to 150°C without derating, giving freedom to miniaturise power modules for applications that demand high reliability in harsh conditions has been introduced by STMicroelectronics.