Search results for "miniaturisation"

The piezo actuator with haptic feedback and integrated sensor functionality has been presented by TDK Corporation at this year’s electronica.The new actuator specialises in acceleration, force and response time, and helps toenhance the sensory experience of HMIs by engaging the full range of human tactile sensitivity.

Leti CEO Marie Semeria delivered a sweeping, optimistic assessment of a rapidly evolving world where “hyperconnectivity” and the Internet of Things – guided by a “human-centered research approach and symbiotic development strategies” – herald profound changes in the way individuals relate to each other and to the physical world.

A joint press conference presenting a miniaturised high-speed connector for robust Ethernet cabling was held by HIROSE Electric and HARTING at electronica on 9thNovember 2016 in Munich (Hall B2/stand 542).The ix IndustrialTM arose from a collaboration between HIROSE and HARTING. It offers a technological basis for a standard in the area of the familiar RJ45.

Bumpy surfaces with graphene between would help dissipate heat in next-gen microelectronic devices, according to Rice University scientists.Their theoretical studies show that enhancing the interface between gallium nitride semiconductors and diamond heat sinks would allow phonons – quasiparticles of sound that also carry heat – to disperse more efficiently. Heat sinks are used to carry heat away from electronic devices.

The electrical and electronics (E&E) industry is under unprecedented regulatory pressure to conform to tough health, safety and environmental directives that render many commonly used plastics and elastomers non-compliant.

Prior to the electronica exhibition in Munich, Electronic Specifier Editor Joe Bush caught up with Dr. Boris Golubovic, Vice President of Marketing and Strategy, Electronics Business Unit, Littelfuse, to discuss the company’s focus at the show and how it is tackling the challenge of the Internet of Things (IoT).

Acal-BFi has signed an exclusive pan-European distribution agreement with USI, a global wireless module and System-in-Package (SiP) manufacturer. With a complete Internet of Things (IoT) offer, Acal BFi’s customers can now access advanced wireless technology with the expertise to apply it effectively.

The recent UK launch of HARTING’s Han-Modular Switch US4 connector has been reaffirmed as a strategic part of its Industry 4.0 portfolio. This connector is designed to save control cabinet space, reduce wiring and improve distributed networking, specifically in support of Industry 4.0 modernisation programmes.

ROHM presents two LDO regulator families: the BUxxJA2MNVX-C series is the world’s smallest automotive-grade LDO regulator whereas the BD7xxLx series provides unmatched 6µA quiescent current features. Both series are available at distributor Rutronik as of now.The BD7xxLx series is optimised for all applications that are connected to the battery and require an extreme low quiescent current.

Amphenol FCI has launched the Minitek MicroSpace Crimp-to-Wire (CtW) Connector Platform. The unique design of Minitek MicroSpace CtW connector platform enables high density (up to 1.27mm) contact pitch while preserving compatibility with the LV214 Severity-2 standard. This makes it a suitable interconnect solution for new and emerging Automotive Electronics applications.