Search results for "thermal"
iWave launches iW-RainboW-G58M
iWave is delighted to announce the launch of its iW-RainboW-G58M System on Module (SoM), a significant development in the field of Electrostatic Loudspeaker technology.
Altus releases 2024 product brochure
Altus Group has published its 2024 product brochure featuring technologies aimed at helping manufacturers enhance quality, efficiency, and capabilities.
Indium Corporation to showcase preforms at SPIE Photonics West
Indium Corporation will showcase its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, taking place from January 27thFebruary 1stin San Francisco.
Samtec FireFly Micro Flyover System now shipping
Samtec is now shipping the Optical FireFly Micro Flyover System, the first interconnect system with the flexibility to use micro-footprint high-performance optical and copper interconnects interchangeably.
New Yorker Electronics announce release of new by Vishay Intertechnology wet tantalum capacitors
New Yorker Electronics has announced the release of a new series of wet tantalum capacitors by Vishay Intertechnology, featuring hermetic glass-to-metal seals.
Ambarella expands autonomous driving AI domain controller family
Ambarella has announced during CES the latest additions to its CV3-AD family of automotive AI domain controllers—the CV3-AD635 and CV3-AD655 systems-on-chip (SoCs).
Diversifying energy storage for a sustainable future
The global transition to renewable energy hinges on batteries. Whether it's our electric vehicles (EVs) for transportation or our electricity grids for daily energy use, sustainable batteries are crucial for enabling reliable and efficient utilisation of clean energy.
Indium Corporation expert to present at Power Device & Module Expo at NEPCON
Indium Corporation Senior Area Technical Manager Jason Chou is set to deliver a presentation at the Power Device & Module Expo, held in conjunction with NEPCON Japan, on January 24th in Tokyo.
SiC PIMs can accelerate ultra-fast EV charging platforms
Nine new EliteSiC Power Integrated Modules (PIMs) have been introduced by onsemi. They enable bidirectional charging capabilities for ultra-fast electric vehicle (EV) chargers and energy storage systems (ESS).
Diamond-enhanced GaN transistors in heat management
In an exciting advancement in semiconductor technology, researchers at Osaka Metropolitan University have integrated gallium nitride (GaN) transistors with diamond substrates, addressing the increasing heat management challenges in miniaturised semiconductor devices.