Search results for "panasonic"

Toshiba Electronics Europe and Panasonic Industrial Devices Sales Europe have announced that they are cooperating on a highly integrated module that will enable users to add Bluetooth connectivity to devices easily and efficiently. Target applications will include industrial, automation, medical, personal sport and fitness equipment.

Europlacer recently added a new member to its customer support team – Senior Field Service Engineer Viet Nguyen. In his new role, Nguyen will be responsible for supporting customers’ SMT pick-and-place process requirements, machine maintenance and service along with technical support.

Greater comfort, increased safety and reduced CO2 emissions are some of the key features included in today’s successful automobiles and all made possible by the advent of automotive electronics. Sustained growth in this electronics sector is driven by unrelenting market demand: Strategy Analytics market researchers predict that the global automotive electronics market will generate a market volume of 220 billion US dollars by 2014.

Murata Manufacturing Company has announced that it has purchased the multilayer ceramic capacitor (MLCC) business from Panasonic Electronic Devices (PED). This acquisition increases Murata’s international competitiveness in the MLCC market as PED's technology and customers will be transferred to Murata.

TTI, Inc., the global distributor of Passive, Interconnect, Relay & Switch and Discrete components, has announced experienced industry figure, Felix Corbett as its new Director of Supplier Marketing, responsible for Passives and Discrete Components in Europe.

Tensilica, Inc. today announced that over 30 companies that either license Tensilica’s popular processor cores or use merchant market semiconductor products that include Tensilica’s cores will be displaying products at this week’s International Consumer Electronics Show (CES). These Tensilica-enabled products include some of the most advanced, innovative consumer devices, including LCD TVs, cellular phones, WiFi-enabled notebook computers, ...

Tensilica,® Inc. today announced that Panasonic Mobile Communications Co. Ltd. has licensed the Xtensa® LX2 customizable processor core for a baseband processor integrated circuit for mobile phones. Now Panasonic Mobile will develop several different configurations of the Xtensa processor.

Furthering its efforts to enable wireless connectivity technologies in portable designs, Texas Instruments has announced it has coupled its seventh-generation Bluetooth® offering, the CC2560, with an embedded Bluetooth stack running on TI’s ultra-low power MSP430™ microcontroller (MCU). Two development kits, the EZ430-RF2560 development tool and PAN1315 evaluation module (EMK), are immediately available to new and existing customers for eva...

Arrow Electronics has announced the roll-out of its Embedded Platform Concept (EPC) to customers in Denmark, Finland, Norway, Sweden, the UK and the Baltic countries. The concept allows developers to quickly and easily create application-optimised designs, significantly reducing embedded system development time and cost.

Reed Exhibitions recently announced that NEPCON China 2012 will take place at the Shanghai World Expo Exhibition & Convention Center from April 25-27. The event will boast four new segments featuring electronic static discharge, electronics manufacturing automation, advanced electronics packaging and touch panel.