Search results for "TSMC"
Imec successfully evaluates replacement metal gate options for further transistor scaling
Imec is successfully testing and evaluating various options for further transistor scaling using high-k dielectrics and metal gates in a replacement metal gate integration schema. Although RMG technology is inherently more complex than gate-first integration, it has a number of advantages that allow increasing the device performance and that widen the choices in terms of high-k and metal gate materials.
Access to TSMC technologies through leading European partners: imec and DELTA partner to provide comprehensive ASIC solutions
Imec, certified TSMC Value Chain Aggregator (VCA), and DELTA Microelectronics, a leading provider of ASIC services, have concluded a cooperation agreement to provide customers in Europe, the Middle East and Africa (EMEA) with comprehensive TSMC-based turnkey and partial turnkey ASIC services.
MOSIS to unveil affordable access to 65nm wafer fab technologies at DATE 2007
At the upcoming DATE 2007 show, MOSIS, the multi-project wafer (MPW) service provider, will introduce low cost access to the latest 65nm wafer fabrication technologies from IBM, including the foundry’s low power and RF technologies. The MOSIS service is based upon multiple integrated circuit designs sharing each mask set and wafer. Costs are shared between users of the service, based upon the silicon area that each design occupies. This makes ...
STMicroelectronics Joins CEA-Leti IMAGINE Program to Develop Multiple E-Beam Lithography
STMicroelectronics and CEA-Leti, the leading French semiconductor research institute, have signed an agreement for STMicroelectronics to join the new industry/research multi-partner program IMAGINE, led by CEA-Leti, which includes TSMC, for mask-less lithography for IC manufacturing. This three-year program is meant to allow companies to assess a maskless lithography infrastructure for IC manufacturing and the use of MAPPER Technology for high-th...
Dialog Semiconductor and TSMC create a process platform to advance BCD power management leadership
Dialog Semiconductor plc today announced it is working closely with TSMC to develop its next generation of bipolar-CMOS-DMOS technology specifically tailored to high-performance power management ICs (PMICs) for portable devices.
Extreme Results in Top 25 2011 Semiconductor Sales Ranking!
Although only 2% growth was registered in the worldwide semiconductor market (including ICs and Optoelectronics, Sensors, and Discretes; O-S-Ds) in 2011, several companies posted results that were far different (Figure 1). Boosted by its acquisition of Sanyo’s semiconductor business, ON Semiconductor registered a 49% sales increase last year and moved into the top 25 ranking for the first time!
Five Companies to Account for 64% of $61.4B Semiconductor Capex in 2012
Despite reducing its 2012 planned capital spending by $1.0 billion on September 7, 2012, Intel and four other large semiconductor suppliers are still expected to account for almost two-thirds of industry-wide capital expenditures in 2012, according to new data released by IC Insights.
Semiconductor R&D Spending to Hit Record-High $53.4 Billion
Spending on research and development by semiconductor companies worldwide is expected to grow 10% in 2012 to a record-high $53.4 billion compared to the current peak of $48.7 billion set in 2011, according to the Mid-Year Update of IC Insights’ 2012 McClean Report. The increase will lift R&D spending by chip companies to 16.2% of total semiconductor sales in 2012, which are now forecast to rise 3% to $329.8 billion from revenues of $321.4 bill...
Mentor Graphics and TSMC Address Advanced Node Fill Requirements Using Calibre SmartFill
Mentor Graphics Corporation announced a collaboration with TSMC to support SmartFill functionality in the Calibre® YieldEnhancer product for TSMC’s manufacturing processes starting at 65nm. The analysis and automatic filling capabilities of the SmartFill solution allow designers to achieve IC fill constraints with minimal impact on circuit performance in a single pass without manual customization or modification.
Infineon Claims World's Smallest HSPA+ Solution for 3G Smart Phones
Infineon Technologies announced the availability of XMM™6260, the latest platform in its 3G slim-modem family. The XMM 6260 platform is optimized as a slim-modem for smart phone architectures coupled with an application processor or as a standalone solution for PC modems and data cards. This advanced HSPA+ platform is based on two new highly integrated Infineon devices: the X-GOLD™626 baseband processor and the SMARTi™UE2 Radio Frequency (R...