Search results for "ASIC"
Accurate temperature measurement based on MEMS tech
Omron Electronic Components has extended its non-contact MEMS thermal sensor range with a new narrow-field version specifically designed to provide accurate non-contact measurements of an objects’ surface temperature for industrial control, medical and building automation systems. Omron is relaunching its full range of MEMS thermal sensors in Europe, including wider field versions ideal for detecting room occupancy and similar applications.
Addressing the challenges of IoT implementation
The SIPO IoT Forum, taking place on 20th June 2017 and the NKIC Seminar at Nan-Kang Incubation Center on the 22nd June 2017, both taking place in Taipei, Taiwan, will see Cortus present the ‘Challenges in ASIC Design for IoT’.
Duo accelerate development of wireless power solution
An agreement to develop and market one of the industry’s most promising wireless power solutions for consumer electronic devices and the fast-growing IoT space has been announced betweenON Semiconductor and PowerSphyr. The agreement calls for ON Semiconductor to integrate its efficient power management components with PowerSphyr’s wireless power transfer (WPT) technology, which combines near-field and far-field wireless charging, to c...
Advanced bus converter upgraded to include burst-mode capability
The award-winning BMR458 third-generation 3E quarter-brick advanced bus converter from Ericsson Power Modules has been upgraded to integrate burst-mode operation, which enables the module to handle 1079W of peak power for a brief period of time, up to a maximum of one second.
Parallelism technology reduces regression turnaround time
Synopsys has announced that Acacia Communications has successfully deployed Synopsys VCS Fine-Grained Parallelism (FGP) technology in production, to reduce regression turnaround time (TAT) by two times. With its seamless integration into Acacia's VCS simulation regression environment on existing X86 hardware platform, VCS FGP delivered these simulation performance gains without any changes or disruption to the existing simulation flow.
Partnership accelerates data mining and analytics
Through a new integration between the Cadence Virtuoso Analog Design Environment (ADE) Product Suite and MATLAB, Cadence Design Systems has expanded its partnership with MathWorks. This enables customers to accelerate processing of large data sets when verifying custom, RF and mixed-signal designs. With this integration, designers can take advantage of existing MATLAB scripts and seamlessly share data between the Virtuoso and MATLAB platforms, al...
IoT reference platform improves next-gen wearables
EnSilica and sureCore have announced that EnSilica has developed sureCore’s new, ultra-low power IoT reference platform targeted principally at the development of the next generation of wearable consumer and medical applications.With proven expertise in low power SoC design for battery powered applications, EnSilica’s experienced silicon team is able to deliver a complete, turn-key service covering complex digital and analog/RF techno...
Force sensing broadens its application horizons
Peratech’s force sensing technology is moving from the lab into consumer products and beyond. By Sally Ward-Foxton.British startup Peratech, whose QTC force sensitive material allows force sensors to screen print onto a range of substrates, is starting to see its first QTC-enabled consumer products on the market. Following investment in 2014, a new executive team was brought on board and the company’s business model changed from licen...
Detection distance increased in Infrared array sensor
The improved and accurate second generation of Panasonic’s Grid-EYE infrared array sensors is now available in Europe through TTI. The new high gain types (AMG8833 and AMG8834) and low gain types (AMG8853 and AMG8854) of Grid-EYE 2nd Generation benefit from an improved NETD (Noise Equivalent Temperature Difference) of 0.16°C at 10Hz and of 0.05°C at 1Hz.
Thin uModule regulator fits on the backside of PCB
The LTM4643 is a quad output step-down µModule (power module) regulator, configurable as a single output (12A), dual (6 and 6A or 9 and 3A), or quad (3A each) regulator in a 9x15x1.82mm ultrathin LGA package.