Search results for "thermal"

Ventec has announced that its VT-901 polyimide material is now fully and exclusively qualified by ESA in ACB Belgium’s manufacture of High-Density Interconnect (HDI) PCBs.

TE Connectivity (TE) will showcase a broad range of high-speed data communications connectivity solutions in booth 913 during DesignCon at the Santa Clara Convention Centre Jan 30 – Feb 1, 2024.

Nisshinbo Micro Devices Inc. has introduced the NC2780AK series switching regulators, designed for use in a variety of sectors including consumer electronics, industrial, and automotive applications.

Phlux has announced its first products, the Aura family of 1550 nm devices based on the company’s Noiseless InGaAs APD technology.

Alpha and Omega Semiconductor has announced the AONA66916, a 100V MOSFET packaged in a top and bottom side cooling DFN 5 x 6 package.

Panasonic Industry releases HE-R relay variant complying with UL508 and US 1-phase charging systems.

Inelco Hunter has announced the availability of the TechNexion range of Embedded Camera Modules.

StoreDot has unveiled an innovative concept for taking extreme fast charging (XFC) capability from the cell to the vehicle level with its new I-BEAM XFCTM concept, an new cell-to-pack (CTP) design that will accelerate the integration of XFC into EVs.

Adeia research has found an increased demand for AI chipsets which will spur requirements for hybrid bonding technology across the semiconductor industry.

Microchip has launched the MCP998x family of 10 automotive-qualified remote temperature sensors.