Search results for "miniaturisation"

Believed to be the first DC/DC converter that is capable of DC fan motor speed control, the BD9227F reduces real estate demands (Visit PCIM Europe 2017 Stand 9-316).Designed to benefit integrated design, with a 75% reduction in mounting area compared with that of discrete configurations, the buck DC/DC converter is optimised for DC fan motor power supplies used in applications such as cold air circulation in refrigerators, says Rohm.

W. L. Gore & Associates has introduced its High WEP Series: a versatile venting solution to the increasingly stringent reliability requirements faced by design engineers and manufacturers of automotive electrical/electronic modules (EEMs).Increasingly, EEMs require greater thermal, mechanical and chemical reliability. As electronic devices are mounted closer to the point of use, they are exposed to harsher operating environments and chemical ...

The availability of a new thermal printhead has been announced by ROHM designed for receipt printers in payment terminals capable of being driven by a single-cell li-ion battery.Thermal printheads are electronic devices that print on special media (i.e. thermal paper) by precisely and repeatedly generating and dissipating heat. Conventional thermal printheads for payment terminals are driven by 2-cell li-ion batteries.

Hirose has created an ultra low-profile wire-to-board power connector that enables the continued miniaturisation of consumer and portable electronic devices.

Giving system integrators design flexibility the Atto320 enables improved performance and cost differentiation in handheld thermal cameras.ULIS has announces the launch of Atto, the first in a family of 12µ, stand-alone, image sensors. The 12µ pixel pitch is the new industry standard in thermal image sensors for market applications where reducing the overall size and cost of the camera are important. Key markets include the outdoor le...

The programmable logic controller (PLC) that is today a mainstay of industrial automation is set for major changes in combination with the move to industrial internet of things (IIoT).

Three world records have been set in the 'Swiss Silicon Valley'. Swatch Group has introduced a new Bluetooth chip with what it claims to be exceptional features unrivaled by any existing product. The new integrated circuit, designed 100% by EM Microelectronic, Swatch Group R&D and the Swiss Centre for Electronics and Microtechnology (CSEM), has already set the following records.

AT&S is participating in the Horizon 2020 EU Research and Innovation programme along with 11 other organisations who are collaborating on a key GaNonCMOS project. AT&S is also participating in the Panel-Level Packaging Consortium managed by Fraunhofer IZM.

Würth Elektronik eiSos is taking the stage at the embedded world exhibition in Nuremberg (14 to 16 March 2017). The focus of the presentation at Stand 3-359 in Hall 3 will be on miniature components for embedded applications. The appearance at this trade fair also profits from the close cooperation with STMicroelectronics: experts from Würth Elektronik eiSos will also be represented as a partner in the STM32 FanZone at Stand 4A-238.

As 2D integrated circuit (IC) technology nears its scaling limit, there is a need to scale up vertically to cope with the breakneck pace of advances in digital technologies. However, the progress made by the digital components has not been matched by the advances in microelectronic components, which has resulted in hindrances such as memory wall. In this scenario, 3D IC technology’s ability to help create high-performing, low-power-consumin...