Search results for "Fraunhofer"
Axeon to reduce size, weight and cost of EV & Hybrid vehicle batteries
Axeon has been awarded research funding from the EU to dramatically reduce the weight, volume and cost of batteries in electric and hybrid vehicles as part of a consortium programme called SmartBatt.
Loading bays are Like F1 Cars; Getting Faster and Safer in 2011
Ed Wilks, Operations Manager at loading bay equipment specialist, sara LBS, looks back over sara’s developments in 2011 and discusses what is next for the industry. Two new additions to our popular sara LBS Sprint range of high-speed internal and external doors have seen sales grow considerably in the food processing and clean room sectors; offsetting the general slowdown in the construction of new warehouses that require complete new loading ...
Simufact Engineering GmbH continues to grow
Simufact Engineering GmbH continues on growth course. With Dr. Ulrike Beyer as project manager joining technology, and Volker Mensing as director marketing & communications, the Hamburg based company has expanded its competence with two more skilled experts. Already in January, Simufact could win Dr. Ralph Bernhardt as the new Director Research & Development.
Fraunhofer IIS selects DELTA as a primary ASIC service provider
DELTA Microelectronics, the European leader in providing the semiconductor industry with a complete ASIC supply chain solutions, announces that it has been selected by Fraunhofer IIS as a primary ASIC service provider.
austriamicrosystems continuously expands CMOS, High-Voltage, High-Voltage Flash and RF Multi Project Wafer Services for Foundry Customers
austriamicrosystems' Full Service Foundry business unit today released its further expanded fast and cost-efficient ASIC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, with an even more extensive schedule in 2011. The service, which combines several designs from different customers onto one wafer offers significant cost advantages for foundry customers as the costs for wafer and masks are shared among a number of differen...
German Research Project CoSiP Lays Foundation for Simultaneous Development of Chip, Package and PCB Board for System-in-Package Applications
The growing complexity of microelectronic systems makes it necessary to align and coordinate the development of chips, packages and boards at a very early stage, especially when it comes to system-in-package (SiP) applications.