Search results for "thermal"
The potential of AI in motors and drives
Computing Machinery and Intelligence, the seminal paper by Alun Turing, posed the question, “Can machines think?” Turing's research proved that a digital computer could simulate the behaviour of any other digital machine, given enough memory and time. Here, Marek Lukaszczyk, European and Middle East Marketing Manager at WEG, explains how this has led to an effective digital manufacturing environment in which the potential of Artificia...
AMD powers AI track inspection solution for Japanese bullet train
AMD has recently announced its collaboration with JR Kyushu Railway Company (JR Kyushu), a prominent Japanese bullet train operator, leveraging the AMD Kria K26 System-on-Module (SOM) to revolutionise track inspection through automation.
PICMG ModBlox7 specification standardises Box PCs
PICMG, a specialist consortium for the development of open embedded computing specifications,has ratified the ModBlox7 base specification.
Solderstar Reflow Shuttle at IPC Apex Expo 2024
Solderstar will showcase the Reflow Shuttle with O2 measurement module at the IPC Apex Expo 2024 from 9th to 11th April.
Synchronous buck converter operates at 4.5V to 38V
STMicroelectronics has introduced the L6986I device, a high-performance synchronous buck converter that is designed for use in applications that require isolated power conversion.
Two-part structural epoxy meets ISO 10993-5 for non-cytotoxicity
Master Bond Supreme 11AOHTMed is a two-component epoxy featuring thermal conductivity and electrical insulation.
Explorer Bertrand Piccard to circumnavigate the world in hydrogen airplane
In a bold stride towards revolutionising the future of aviation, Swiss explorer Bertrand Piccard recently announced the inception of Climate Impulse, an ambitious project aiming to circumnavigate the globe non-stop in a green hydrogen-powered airplane.
Allegro MicroSystems introduces high-bandwidth current sensor
Allegro MicroSystems announced the launch of its new high-bandwidth current sensors, the ACS37030 and the ACS37032, which enable high-performance power conversion with GaN and SiC technologies in electrified vehicles, clean energy solutions and data centre applications.
Choosing an LED potting compound
Potting and encapsulation are commonly used to protect LED assemblies from shock, vibration, the environment, and for thermal management.
Indium Corporation to give three talks at APEC 2024
Indium Corporation is set to present three insightful contributions at APEC 2024, taking place from 25-29 February in Long Beach, CA. These presentations, delivered by distinguished members of the Indium Corporation team, will delve into various aspects of the power electronics assembly industry.