Search results for "Panasonic"
Closed-loop interface optimises print process
After extensive testing, Panasonic have implemented Viscom's closed-loop interface into it's printers and placement machines. The interface, developed by the two companies, providesa closed control loop between solder paste inspection (SPI) and printer. This allows the print process to be inspected andimmediately optimised. To automatically correct the printing process, data issent from the SPI directly to the printer.
IoT solutions embrace hardware, software and services
Rutronik has launched a new range of bundled hardware, software and services under the RUTRONIK SMART brand. It brings together entire solutions, consisting of selected sensors, wireless components, micro-controllers, power management and safety solutions for devices on the Internet of Things (IoT).
Bluetooth module cuts power consumption by 66%
The PAN1740 Bluetooth Low Energy (BLE) Module from Panasonic is now being shipped by Mouser Electronics. The single-model Bluetooth module reduces power consumption by more than 66% and comes with a fully shielded case that includes an integrated chip antenna and on-board crystal oscillators.
A look at the latest developments in non-volatile memory
The rate at which modern devices generate data means it should come as no surprise that manufacturers are still actively developing alternative and - hopefully - improved non-volatile memory solutions. Philip Ling, Editor, ES Design magazine, takes a look at some of the most recent developments.
NEPCON South China 2014 to host 500 global exhibitors
NEPCON South China isscheduled to take place on the 26-28th August 2014, at theShenzhen Convention & Exhibition Center in Shenzhen, China. This will becomprehensive display of the application of state-of-the-art technologies and products in electronics manufacturing. The event will host over 500 exhibitors from 22 countries and regions, displaying more than 1,000 electronics manufacturing machines and consumables to 32,000 top buyers from acr...
Tackling thermal management for smart building LED design
High lumen density LED arrays are fast becoming the technology of choice for downlights and directional lighting in smart buildings, whether for retrofit or new build applications. Addressing the thermal management challenge presented by these devices can be relatively simple. Alan Jermyn, V.P. European Marketing at Avnet Abacus, explains.
Software for inspection systems features µBGA analysis
Inspection plan generation and analysis software for inspection systems has been released by Viscom. SI 7.47 features Quality Uplink, a downlink function for Solder Paste Inspection (SPI), Integrated Verification,µBGA analysis and an XM converter.
Understanding polymer and hybrid capacitors
Capacitors may seem simple enough, but specifying them has actually grown more complex in recent years. The reason why comes down to freedom of choice. The universe of capacitors has expanded greatly over the past few years, in large part because of capacitor designs that take advantage of advances in conductive polymers.
IC Manufacturers Close or Repurpose 72 Wafer Fabs from 2009-2013
Semiconductor manufacturers closed 72 wafer fabs between 2009-2013 and another nine fabs are slated to close in 2014, according to data recently compiled, updated, and now available in IC Insights’ Strategic Reviews online database and the Global Wafer Capacity 2014 report.
Laminates & prepegs reduce insertion loss
Isola Group has announced the introduction of Tachyon-100G laminates and prepregs, which enable line cards required to transmit 100GbE at data rates in excess of 25Gb/s per channel. Tachyon-100G has identical electrical properties as its predecessor Tachyon; however, the Z-axis CTE on Tachyon-100G is more than 30% lower than Tachyon, making it more suitable for fabricating high-layer count, 0.8 mm pitch line cards with heavy 2 oz. copper inner la...