Search results for "autonomous"

Teledyne e2v announced engineering models of the LX2160-Space 16-core Arm Cortex A72 based system on chip (SoC) processor, enabling early project design, hardware and software validation for space-demanding applications. LX2160-Space engineering models have the same fit/form/function as flight models (FMs).

Teledyne e2v announces engineering models of the LX2160-Space 16-core Arm Cortex A72 based system on chip (SoC) processor, enabling early project design, hardware, and software validation for space-demanding applications. LX2160-Space engineering models have the same fit/form/function as flight models (FMs).

Samsung Semiconductor Europe is presenting innovations in next-generationsemiconductor technologiesfor artificial intelligence (AI), automotive, and beyond at booth B6.602 at electronica 2024 from November 12-15 in Munich.

MIPS, a developer of efficient and configurable IP compute cores, announces the general availability (GA) launch of the MIPS P8700 Series RISC-V Processor. Designed to meet the low-latency, highly intensive data movement demands of the most advanced automotive applications such as ADAS and Autonomous Vehicles (AVs), the P8700 delivers accelerated compute, power efficiency, and scalability.

Syslogic’s AI Rugged Computer RML A4AGX, previously announced in March 2024, is designed for computer vision applications in harsh environments. With its NVIDIA Jetson AGX Orin module, it represents the new performance peak in the Syslogic range and is used to drive AI applications forward.

ITT Cannon, a global specialist in harsh environment interconnect solutions, will showcase new products alongside its robust portfolio of interconnects for transportation, industrial, aerospace, defence, and medical applications in Munich, Germany at electronica 2024 (Booth 119, Hall A2) 12–15 November 2024.

Where and how much is theAI revolution changing the automotive industry? An international mobility study by MHP management and IT consultancy gives an overview, supplies current facts and figures, and provides recommendations for action for decision-makers.

Novosense has announced a range of high-side switches for driving traditional resistive, inductive, and halogen lamp loads in automotive body control modules (BCM) as well as large capacitive loads commonly found in the first-level and second-level power distribution within zone control units (ZCU).

Farnell will showcase the best of industry’s solutions as part of Avnet City at electronica 2024 in Munich (November 12-15).

For the first time, Intel Core i processors with up to eight E-cores are now available on SMARC Computer-on-Modules. This allows even the smallest fanless low-power systems for extended temperature ranges to benefit from extremely powerful AI inference logic and enhanced virtualisation options, improving cyber security among other advantages.