Search results for "autonomous"

Point One Navigation has been chosen by the Indy Autonomous Challenge (IAC) to provide Real-Time Kinematic (RTK) corrections technology. This technology will be used in the world's fastest autonomous racing cars at the Consumer Electronics Show (CES) in Las Vegas.

The Ingress Protection (IP) rating system is a recognised standard for determining the level of protection an electronic device has against external elements like liquids and solids. Specifically, the IP69K rating is one of the highest levels of protection within this system.

Ambarella, an edge AI semiconductor company, and Kodiak Robotics, an autonomous vehicle company focused on trucking and defence, announce that Kodiak selected Ambarella’s CV3-AD685 AI domain control system-on-chip (SoC) as a complete embedded compute solution for its next-generation autonomous vehicles.

The UK could see a significant transformation in motorway transportation with the potential introduction offully autonomouscars by 2026.

Syslogic and Stereolabs have formed a strategic partnership upleveling vision and understanding for autonomous machines.

Ambarella, an edge AI semiconductor company, has announced its autonomous driving (AD) software stack, which is primarily based on deep learning AI processing for all of its modular components, including environmental perception, sensor fusion, and vehicle path planning.

Rotor Technologies, Inc. has announced the launch and commencement of production for the R550X, currently the largest uncrewed civilian helicopter available.

Advantech has announced that the MIC-732-AO, UNO-148 V2, MIC-770 V3 + MIC-75GF10, and IPC-730 have each received a 2024 IoT Edge Computing Excellence Award from IoT Evolution World.

Siemens Digital Industries Software announced its ongoing collaboration with Infineon to combine Siemens embeddedautomotive software platform, based on the AUTOSAR Classic platform R20-11, with Infineon’s AURIX TC4x microcontroller.

The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where optical andelectronic componentsare integrated in a common housing.