Search results for "Fraunhofer"
igus launches wireless system and more
igus reinforced its global position as a leading manufacturer of Energy Chain Systems when it launched numerous new product innovations and extensions at the Hanover show in April. The company revealed it had kept pace with rapid developments in the area of cable-bound chain systems, but also with inductive and wireless data transmission solutions. The key advantages typified by the new product developments included: compact size, easy assembly, ...
Draw-wire sensors used for wind turbine rotor blade testing
Draw-wire displacement sensors from Micro-Epsilon are playing a vital role in the testing of the latest generation of wind turbine blades at the Fraunhofer Institute in Bremerhaven, Germany.
Industrial robot turns into precise machining system
Accurate machining is usually carried out with machine tools or machining centers. This means high costs and workpiece sizes limited by geometrical factors. It would be significantly cheaper and more flexible if industrial robots could be used instead, but their inaccuracy has so far made this impossible. This inaccuracy arises from the long serial kinematics chain with only low stiffness. A different approach is now possible. It has not been nec...
AEG Power Solutions Solar Inverter for Megawatt Applications Achieves Shining Efficiency
A report jointly issued by the Fraunhofer Institute for Solar Energy Systems (ISE) and Bureau Veritas shows that AEG Power Solutions’ Protect PV.250 solar inverter offers remarkable efficiency. Energy conversion efficiency testing conducted according to European Standard EN 50530 yielded a very high efficiency grade of 98.7%.
austriamicrosystems expands CMOS, High-Voltage, High-Voltage Flash and RF Multi Project Wafer Service for Foundry Customers
austriamicrosystems business unit Full Service Foundry expands its fast and cost-efficient ASIC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, in 2010 with a more extensive schedule. The service which combines several designs from different customers onto one wafer offers significant cost advantages for foundry customers as the costs for wafer and masks are shared among a number of different shuttle participants.
Automated X-Ray PCB inspection to be demonstrated by YESTech-Europe in Nuremberg SMT/Hybrid/Packaging exhibition’s live production line
Visitors to the Nuremberg SMT/ Hybrid/Packaging show in June will have an opportunity to see how automated X-Ray inspection improves speed and reliability in electronics manufacturing. Throughout the event, Nordson YESTECH’s in-line X3 X-Ray automated inspection system will be on show within a live demonstration production line. The X3’s state of the art, patented digital imaging technology achieves a high rate of failure detection with a fas...
sara / LBS LAUNCHES FIRST EN ISO CERTIFIED CLEANROOM DOOR
sara / LBS has overcome the historical problem of industrial doors with no specific certifications for clean room environments, by launching the sara Sprint Cleanroom Door: the first door to be tested by the Fraunhofer Institute for clean room suitability, and certified to EN ISO 14644-1 Class 5.
Industry and Research Centres Create a European Technology Platform for High Performance Computing
Major suppliers of High Performance Computing technologies including Allinea, ARM, Bull, Caps Entreprise, Eurotech, IBM, Intel, ParTec, STMicroelectronics and Xyratex in association with HPC research centres BSC, CEA, CINECA, Fraunhofer, Forschungszentrum Juelich and LRZ have created a European Technology Platform for HPC (ETP4HPC) and released the ETP’s Vision document to improve Europe’s position in the domain of HPC technologies.
Fraunhofer IIS Becomes Tensilica Authorised Design Centre Partner
Tensilica, Inc. announced that Fraunhofer IIS, has joined Tensilica's Xtensions partner network and become an authorised design centre. Fraunhofer IIS will support mutual customers with their audio-related SOC (system-on-chip) designs.
“Mainstream GaN” Today and Tomorrow: Spotlight on NXP’s High-Performance GaN Solutions at International Microwave Symposium 2012
Recognized as a compelling alternative to silicon for many RF applications, GaN technology has generated significant industry interest due to its performance advantages, but has faced significant challenges related to cost – until now.