Search results for "EDA"

Agilent Technologies has today revealed shipment of Advanced Design System 2012, its flagship RF and microwave EDA software platform. ADS 2012 features new capabilities that improve productivity and efficiency for all applications the system supports and breakthrough technologies applicable to GaAs, GaN and silicon RF power-amplifier multichip module design.

Agilent Technologies today announced the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program. With IC-CAP 2013.01, Agilent introduces major improvements to its flagship product for high-frequency device modeling. One key improvement is turnkey extraction of the Angelov-GaN model, the industry standard compact device model for GaN semiconductor devices.

Super Micro Computer debuts a new line of ultra high performance “Hyper-Speed” servers this week at High Frequency Trading World, New York. These new 2U and 4U/Tower platforms deliver unparalleled performance for HFT applications by maximizing processing power and precisely tuning hardware and firmware to attain up to 30% lower latency over competitive solutions while still maintaining high reliability as a primary design focus.

The term ‘smart system’ is well used, but what exactly does it mean? There are many definitions but the one that fits best for the purposes of this discussion is that provided by the European Commission’s CORDIS programme: “Smart systems typically are sensors and/or actuators with an ability to process data, diagnose complex situations, communicate with each other and be autonomous in energy use.”

Agilent have today introduced a redriver modeling solution designed to quickly and accurately solve the challenge posed by signal distortion in multigigabit-per-second systems. The redriver modeling solution, available in the Advanced Design System 2012 Transient Convolution Element and SystemVue 2012 AMI Modeling Kit, is used to design electrical redrivers into high-speed chip-to-chip digital links.

Cadence Design Systems announced today the tapeout of a 14-nanometer test-chip featuring an ARM Cortex-M0 processor implemented using IBM’s FinFET process technology. The successful tapeout is the result of close collaboration between the three technology leaders as they teamed to build an ecosystem to address the new challenges from design through manufacturing inherent in a 14-nanometer FinFET-based design flow.

Renesas have today unveiled the release of version 1.1 of its Eclipse-based integrated development environment, e2studio, designed to provide a flexible development platform for its market-leading RX and RL78 microcontrollers.

RFEL has been approved as a member of the Xilinx Alliance Program. We have worked with RFEL for many years, said Mark Bowlby, Senior Manager of Partner and Ecosystem Alliances at Xilinx.

Tanner EDA has released version 15.23 of its full-flow analog and mixed-signal design suite: HiPer Silicon. The addition of HiPer Simulation AFS to version 15.23 gives designers added capabilities for front-end design flow, including schematic capture, dual circuit simulators and waveform probing.

For more than forty-six years the 516 series has been one of the core products in the EDAC portfolio. It would be a reasonable question to ask “how does any product - especially one in the high-tech, fast moving electronics industry, retain relevance and popularity after that period of time”? The answer is not simple, however there is no doubt that the superbly engineered design of the 8.5 amp rated, gold-plated, ‘tuning fork’ or hermaph...